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0.8mm board thickness 2-Layer Electronic pcb fast prototype, printed wire layout design
2-Layer pcb fast prototype
1.FR4 with immersion gold
2.1OZ copper thickness
3.0.8mm board thickness
Detailed specification of PCB manufaturing capacity:
Surface processing type | HASL/ plating gold /immersion gold/ Ni/Au plating gold finger/OSP processing/immersion Tin /immersion siler |
Layers | single-sided,double-sided,multilayer pcb board |
Min trace width | 6mil |
Min space width | 3.0mil |
Min trace to pad/pad to pad space | 6mil |
Min drill diameter | 0.2mm |
Min via pad | 0.6mm |
Max board size | Single and double sides:550mmX1100mm;multilayer:550mmX640mm |
Molding board thickness | 0.08-0.24mm |
Min solder mask dam | 6mil |
Min solder mask clearance | 1.5mil |
Min solder mask thickness | 10um |
Solder mask type | Green/yellow/black/red/white/blue or transparent photosensitive solder mask and peel off blue glue. |
Min silk legend width | 6mil |
Min silk legend height | 25mil |
Silk legend color | White/ yellow /black |
Data file format | GERBER file and corresponding drilling file,PROTEL
series,PADS2000,POWERPCB series,ODB++ |
Electricity performance testing | 100% electrical performance testing,high pressure testing |
Various types base material to PCB processing | High TG board, high frequency board(ROGERS,TEFLON) halogen-free board (FR-4,CEM-1,CEM-3) |
Other testing request | Impendence testing, Hole resistance testing, gold slice up, Solder ability. |