

Add to Cart
2-Layer pcb prototype
1.FR4 with lead-free HASL
2.0.5OZ copper thickness
3.0.8mm board thickness
Our Factory Manufacture Capability.
Item | Manufacture Capability | |
Material | FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant), Aluminium, Metal based | |
Layer No. | 1-16 | |
Finished Board thickness | 0.20 mm-6.0mm’(8 mil-150 mil) | |
Board Thickness Tolerance | ±10% | |
Cooper thickness | 0.5 OZ-6OZ (18 um-210 um) | |
Copper Plating Hole | 18-40 um | |
Impedance Control | ±10% | |
Warp&Twist | 0.70% | |
Peelable | 0.012"(0.3mm)-0.02’(0.5mm) | |
Images | ||
Min Trace Width (a) | 0.075mm (3mil) | |
Min Space Width (b) | 0.1mm (4 mil) | |
Min Annular Ring | 0.1mm (4 mil) | |
SMD Pitch (a) | 0.2 mm(8 mil) | |
BGA Pitch (b) | 0.2 mm (8 mil) | |
0.05mm | ||
Solder Mask | ||
Min Solder Mask Dam (a) | 0.0635 mm (2.5mil) | |
Soldermask Clearance (b) | 0.1mm (4 mil) | |
Min SMT Pad spacing (c) | 0.1mm (4 mil) | |
Solder Mask Thickness | 0.0007"(0.018mm) | |
Holes | ||
Min Hole size (CNC) | 0.2 mm (8 mil) | |
Min Punch Hole Size | 0.9 mm (35 mil) | |
Hole Size Tol (+/-) | PTH:±0.075mm;NPTH: ±0.05mm | |
Hole Position Tol | ±0.075mm | |
Plating | ||
HASL | 2.5um | |
Lead free HASL | 2.5um | |
Immersion Gold | Nickel 3-7um Au:1-5u'' | |
OSP | 0.2-0.5um | |
Outline | ||
Panel Outline Tol (+/-) | CNC: ±0.125mm, Punching: ±0.15mm | |
Beveling | 30°45° | |
Gold Finger angle | 15° 30° 45° 60° | |
Certificate | ROHS, ISO9001:2008, SGS, UL certificate |
Our PCBs are widely used in communication apparatus,automobile electronics,computers,
power supply,medical devices and network devices and consumer electronics class fields
such as GPS,UPS,Set-top Box,telecomunication,LED,etc.