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Through - Hole Gold Plating 1 - 16 Layer Electronic PCB Assembly With Electrical Test
Description:
Layer | 1-16 |
Material | FR4 |
Thickness | 0.2-3.2mm |
Surface finishing | HAL/ENIG |
Copper | 0.5-3oz |
Test | Electrical Test |
A PCB populated with electronic components is called a printed
circuit assembly (PCA), printed circuit board assembly or PCB
Assembly (PCBA).
After the printed circuit board (PCB) is completed, electronic components must be attached to form a functional printed circuit assembly, or PCA (sometimes called a "printed circuit board assembly" PCBA). In through-hole construction, component leads are inserted in holes. In surface-mount construction, the components are placed on pads or lands on the outer surfaces of the PCB. In both kinds of construction, component leads are electrically and mechanically fixed to the board with a molten metal solder.
Applications:
Printed circuit board assembly (pcb assembly or pcba) can be used for all kinds of electrical products, such as computer, radio, TV, mobile, mp4, led and so on. It’s widely used in various of industries in the world. We have been pcb/pcba business for ten years and provide different customized pcb to many countries all over the world. Welcome to contact us for further news.
Specifications:
Product Technical Parameter | |||
Basic technology | Parameter | ||
Single/Double sided | Multilayer | ||
Number of Layers | 1-2 | 4~16 | |
Copper Thickness | 0.25~3.0OZ | 0.5~3.0OZ | |
Base Board Thickness | 0.2~3.2mm | 0.6~3.2mm | |
Incombustibility | 94V-0 | 94V-0 | |
Peelable resistance | 12.3N/cm | 12.3N/cm | |
Twist | ≤0.5% | ≤0.5% | |
Insulation resistance | ≥1011Ω | ≥1011Ω | |
Test voltage | 10-300V | 10-300V | |
Finished board area | 560×970mm | 560×970mm | |
Min. Line Width and Spacing | 0.1/0.1mm | 0.1/0.1mm | |
Copper thickness in hole | ≥25.0um | ≥25.0um | |
Mini. pad diameter | Inner layer |
| 0.05mm |
Out layer | 0.076mm | 0.076mm | |
Mini. Hole Diameter | 0.25mm | 0.20mm | |
Hole tolerance | PTH | ±0.076mm | ±0.076mm |
NPTH | ±0.05mm | ±0.05mm | |
Hole location tolerance | ±0.076mm | ±0.05mm | |
profile tolerance | Routing | ±0.1mm | ±0.1mm |
Punching | ±0.13mm | ±0.13mm | |
Solder mask bridge ability | ≥0.1mm | ≥0.075mm | |
Solder mask rigidity | 6H | 6H | |
Solderable test | 245℃ 5 second | 245℃ 5 second | |
Thermal cycling ability | 288℃ 10 second | 288℃ 10 second | |
Surface Finishing | OSP, HAL, HAL Lead-free, Immersion gold , Gold plating, Rosin, Gold finger, Immersion Tin and so on | ||
Qaulity standard | IPC-A-600F IPC-ML-950 | ||
Sample standard | STD-105E-Ⅱ |
Competitive Advantage:
1, Excellent quality control service
2, Competitive price
3, Quick production time
4, PCB design/production/test integrated service