10 Layer OSP / ENIG PCB / Multilayer PCB / prototyping circuit board

Brand Name:ZhenXian
Model Number:PCB-2117
Minimum Order Quantity:NO MOQ
Delivery Time:5-12Days
Payment Terms:T/T,OA, L/C, Western Union
Place of Origin:Shenzhen, China
Contact Now

Add to Cart

Active Member
Location: Shenzhen Guangdong
Address: 7/F, High-Tech Park, Shangkeng Community, Guanlan Subdist., Baoan District, Shenzhen, Guangdong, China (Mainland)
Supplier`s last login times: within 1 hours
Product Details Company Profile
Product Details

10 Layer OSP / ENIG PCB / Multilayer PCB / prototyping circuit board

Specifications

1.10 layer telecommunication circuit boards
2.PCB sample prototypes supply
3.Quick Turn, OEM/ODM
4.One-stop turnkey service


Detailed Product Description

1.High precision telecommunication pcb circuit board

2.Buried and blind holes vias laser drilling

3.ICT function and testing instruction test

4.PCB reverse engineering service

5.Small as well as large volume production with flexibility

6.CNC package for bare PCB and ESD package for PCBA aasemble with POE box Package


Layer: 10 Layer

Material: FR4

Thickness: 1.6mm

Copper thickness: 1oz finish

Mini Hole: 0.1mm

Mini Width/space: 0.1mm/0.1mm

Testing points:4000

Solder Mask: LPI Green

Sickscreen: White

Function: Telecommunication

Finish: Immersion tin

1.PCB Manufacture Capability

Item

Capability

1.Base Material

FR-4 / High TG FR-4 / Lead free Materials (ROHS Compliant) / Halogen Free material /CEM-3/CEM-1/ /PTFE/ROGERS/ARLON/TACONIC

2.Layers

1-28

3.Finised inner/outer copper thickness

1-6OZ

4.Finished board thickness

0.2-7.0mm

Tolerance

Board thickness≤1.0mm: +/-0.1mm

1<Board thickness≤2.0mm: +/-10%

Board thickness>2.0mm: +/-8%

5.Max panel size

≤2sidesPCB: 600*1500mm

Multilayer PCB: 500*1200mm

6.Min conductor line width/spacing

Inner layers: ≥3/3mil

Outer layers: ≥3.5/3.5mil

7.Min hole size

Mechanical hole: 0.15mm

Laser hole: 0.1mm

Drilling precision: first drilling

First drilling: 1mil

Second drilling: 4mil

8.Warpage

Board thickness≤0.79mm: β≤1.0%

0.80≤Board thickness≤2.4mm: β≤0.7%

Board thickness≥2.5mm: β≤0.5%

9.Controlled Impedance

+/-5%

10. Aspect Ratio

15:1

11.Min welding ring

4mil

12.Min solder mask bridge

≥0.08mm

13.Plugging vias capability

0.2-0.8mm

14. Hole tolerance

PTH: +/-3mil

NPTH: +/-2mil

15.Outline profile

Rout/ V-cut/ Bridge/ Stamp hole

16.Surface treatment

OSP: 0.5-0.5um

HASL: 2-40um

Lead free HASL: 2-40um

ENIG: Au 1-10U’’

ENEPIG: PB 2-5U’’/ Au 1-8U’’

Immersion Tin:0.8-1.2um

Immersion silver: 0.1-1.2um

Peelable blue mask

Carbon ink

Gold plating: Au 1-150U’’

17. E-testing pass percent

97% pass for the first time,+/-2%(tolerance)

FQC-Physical Lab: Reliability tests

18.Certificate

ROHS UL:E327776 ISO9001:2008 IPC SGS

Our equipments

1.Drilling workshop

4 drilling bits of drilling machine: 4 sets

2 drilling bits of drilling machine: 2 sets

2. photo plotting workshop

Israel “ORBOTECH” Photo Plotters

3.AOI

AOI machine

4.IPQC

“OXFORD” CMI 700 Copper Thickness Tester

5.Impedance test

USA “Tektronix” DSA 8200 Impedance Tester

6.Outline workshop

CNC routing machine: 7 sets

angle-cutting machine

V-cut machine

7.Testing Workshop

Surpass X-600: 2sets

WTD FT-2808: 5sets

WTD HV300: 1set

8.X-ray

X-ray machine

Acceptable file format

GERBER file, PROTEL series, PADS series, POWER PCB series, AutoCAD series.


China 10 Layer OSP / ENIG PCB / Multilayer PCB / prototyping circuit board supplier

10 Layer OSP / ENIG PCB / Multilayer PCB / prototyping circuit board

Inquiry Cart 0