Product Details
PCB Laser Depaneling Machine for Stress Free Cutting,PWB Separator
This systems can process even highly complicated tasks with printed
circuit boards (PCBs). They are available in variants for cutting
assembled PCBs, flexible PCBs and cover layers.
Process advantages
Compared to conventional tools, laser processing offers a
compelling series of advantages.
- The laser process is completely software-controlled. Varying
materials or cutting contours are easily taken into account through
adapting the processing parameters and laser paths.
- In the case of laser cutting with the UV laser, no appreciable
mechanical or thermal stresses occur.
- The laser beam merely requires a few µm as a cutting channel. More
components can thus be placed on a panel.
- The system software differentiates between operation in production
and setting up processes. That clearly reduces instances of faulty
operation.
- The fiducial recognition by the integrated vision system is done in
the latest version around 100% faster than before.
Processing Flat Substrates
UV laser cutting systems display their advantages at various
positions in the production chain. With complex electronic
components, the processing of flat materials is sometimes required.
In that case, the UV laser reduces the lead time and total costs
with every new product layout. It is optimized for these work
steps.
- Complex contours
- No substrate brackets or cutting tools
- More panels on the base material
- Perforations and decaps
Integration in MES Solutions
The model seamlessly integrates into existing manufacturing
execution systems (MESs). The laser system delivers operative
parameters, machine data, tracking & tracing values and
information about individual production runs.
Laser class | 1 |
Max. working area (X x Y x Z) | 300 mm x 300 mm x 11 mm
|
Max. recognition area (X x Y) | 300 mm x 300 mm |
Max. material size (X x Y) | 350 mm x 350 mm |
Data input formats | Gerber, X-Gerber, DXF, HPGL, |
Max. structuring speed | Depends on application |
Positioning accuracy | ± 25 μm (1 Mil) |
Diameter of focused laser beam | 20 μm (0.8 Mil) |
Laser wavelength | 355 nm |
System dimensions (W x H x D) | 1000mm*940mm *1520 mm |
Weight | ~ 450 kg (990 lbs) |
Operating conditions | |
Power supply | 230 VAC, 50-60 Hz, 3 kVA |
Cooling | Air-cooled (internal water-air cooling) |
Ambient temperature | 22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm (71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil) |
Humidity | < 60 % (non-condensing) |
Required accessoires | Exhaust unit |
More information welcome to contact us:
Email: sales@dgwill.com or s5@smtfly.com
Wechat/Whatsapp:+86 13684904990
Company Profile

Established in 2004, Chuangwei Electronic Equipment Manufactory is
a professional manufacturer and exporter that is concerned with the
design ,development and production of pcb depaneling machine, covering punching, routing, laser depaneling & v-groove
cutting, hot bar soldering machine & other SMT equipments. We are located in Dongguan City with convenient transportation
access.
Products are widely used in Automative electronic industry, Mobile
industry, Computor industry, Power supply industry, Connector and
cable industry, household appliances industry, LED lighting
industry.
Covering an area of over 2000 square meters ,we now have over 45
employees,boast an annual sales figure that exceeds USD4000000 and
currently export 45% of our production worldwide.
Our well-equipped facilities and excellent quality control
throughout all stages of production enable us to guarantee total
customer satisfaction. Beside,we have CE certificate for all
equipments.
As a result of our high quality products and outstanding customer
service ,we have gained a global sales network reaching Europe and
America.
If you interested in any of our products or would like to discuss a
custom order,please feel free to contact us ,We are looking forward
to forming successful business relationships with new clients
around the world in the near future.