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Usage
Precisive cut High-energy ting of FPC and organic membrane covering board without molds or
the protection plate. laser source and precise control of laser
beams can improve the processing speed and the accuracy of
processing results. It has all the functions same as the one
produced by LPKF but price is lower.
Characteristic
1. Independent intellectual property rights of the control
software, Humanized interface, complete functions and simple
operation.
2. Processing any graphic, cutting different thickness and
different materials, stratified processing and complete
synchronously
3. Adopt high-performance ultraviolet light laser with short wave
length, high beam quality and higher peak power properties. Because
ultraviolet light is through decomposition, vaporization instead of
melting to cutting the materials, so almost no burrs after
processing, small thermal effect, no stratification, precise
cutting effects, smooth, steep sidewall.
4. Fixed sample by using Vacuum mode, without matrix protection
plate, convenient and improving the processing efficiency.
5. Used for a variety of substrate materials cutting, such as:
Silicon, ceramics, glass, etc.
6. Automatic correction, automatic positioning and multi board cutting function. Automatic board thickness measurement and compensation. Full stroke motor compensation function. Improved cutting accuracy, reduced horizontal vibration. Improved depth cutting accuracy. Improved efficiency in cutting complex patterns.
Item | Specification |
MODEL | YSATM-4C |
Laser Source | 355nm All-solid-state UV laser cutting device,wavelength 355nm |
Laser Power | 10W |
Maximum Processing Size, | 720mm×540 mm(21″×28″) |
XY Platform Maximum Operating Speed | 50m/min |
Positioning accuracy | ±3µm |
Repeat accuracy | ±1µm |
System Processing Precision | ±20µm |
Galvanometer scanning range | 50mm X 50mm |
Cutting Thickness | ≤1mm |
Power | AC 220V/50Hz/2.2KW;380V/50Hz/5.5KW |
Vacuum Requirements | 516m3/h |
Overall Dimensions | 1818mm×2317 mm×1550 mm |
Weight | 3500kg |
Environmental Temperature | 20ºC±1ºC |
Humidity | <60%RH (No dew) |
Ground Amplitude | <5µm |
Vibration Acceleration | <0.05G |
Ground Pressure | 2200kgf/m2 |
Industry-specific control machine, computer equipped flexible processing software | Motion control card and industry machine control mode 100G Equipped with 17 screens, 100G hard disk standard G code, Gerber data, CAD-compatible |