Product Details
UV Laser PCB laser depaneling . FPC laser depaneling equipment.
Printed Circuit Board Laser Depaneling Machine
Laser Depaneling of Printed Circuit Boards (PCBs)
This systems can process even highly complicated tasks with printed
circuit boards (PCBs). They are available in variants for cutting
assembled PCBs, flexible PCBs and cover layers.
Process advantages
Compared to conventional tools, laser processing offers a
compelling series of advantages.
- The laser process is completely software-controlled. Varying
materials or cutting contours are easily taken into account through
adapting the processing parameters and laser paths.
- In the case of laser cutting with the UV laser, no appreciable
mechanical or thermal stresses occur.
- The laser beam merely requires a few µm as a cutting channel. More
components can thus be placed on a panel.
- The system software differentiates between operation in production
and setting up processes. That clearly reduces instances of faulty
operation.
- The fiducial recognition by the integrated vision system is done in
the latest version around 100% faster than before.
Processing Flat Substrates
UV laser cutting systems display their advantages at various
positions in the production chain. With complex electronic
components, the processing of flat materials is sometimes required.
In that case, the UV laser reduces the lead time and total costs
with every new product layout. It is optimized for these work
steps.
- Complex contours
- No substrate brackets or cutting tools
- More panels on the base material
- Perforations and decaps
Integration in MES Solutions
The model seamlessly integrates into existing manufacturing
execution systems (MESs). The laser system delivers operative
parameters, machine data, tracking & tracing values and
information about individual production runs.
Laser class | 1 |
Max. working area (X x Y x Z) | 300 mm x 300 mm x 11 mm |
Max. recognition area (X x Y) | 300 mm x 300 mm |
Max. material size (X x Y) | 350 mm x 350 mm |
Data input formats | Gerber, X-Gerber, DXF, HPGL, |
Max. structuring speed | Depends on application |
Positioning accuracy | ± 25 μm (1 Mil) |
Diameter of focused laser beam | 20 μm (0.8 Mil) |
Laser wavelength | 355 nm |
System dimensions (W x H x D) | 1000mm*940mm *1520 mm |
Weight | ~ 450 kg (990 lbs) |
Operating conditions | |
Power supply | 230 VAC, 50-60 Hz, 3 kVA |
Cooling | Air-cooled (internal water-air cooling) |
Ambient temperature | 22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm (71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil) |
Humidity | < 60 % (non-condensing) |
Required accessoires | Exhaust unit |
Company Profile
YUSH Electronic Technology Co.,Ltd was founded in 2005,is located in the world manufacturing city
Jiangsu,Guprofessional pcb separator/pcb depanelizer electronic
equipment machinery. The company has advanced production and
processing equipment and an experienced development and manufacture
team,half of them have over 10 years experience in electronic
equipment industry.
Begin with 2004 the company leader invested to develop and
manufacture the PCB separator and PCB depaneling machine.From then
on we pay more attention to product quality,safe to use and product
innovation,so far we have produced many high quality, stable
performance, high cost-effective products. Improve production
yields, increase productivity, and thus enhance the market
competitiveness of our customers. Until now we have design
different separating PCB types of PCB separator and PCB depaneling
machine with manual,motor-driven,pneumatic-driven,mold
punching,milling cutter router.Due to the good quality and
reasonable price our customers are all over the world.Up to now
YuSH have became one of the biggest PCB separator production base
in China.






