2.4KW 60000rpm Wafer Cutting Machine For PCB
Brand Name:YUSHUNLI
Certification:CE
Model Number:SDS1000
Minimum Order Quantity:1set
Delivery Time:5-7work days
Payment Terms:L/C, D/A, D/P, T/T, Western Union, MoneyGram
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Location:
Suzhou Jiangsu China
Address:
Building H, GuoRui Pioneering Park, No. 1068 Jinyang East Road, Lujia Town, Kunshan, Suzhou,Jiangsu,China.
Supplier`s last login times:
within 48 hours
Product Details
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Product Details
2.4 KW Semiconductor Wafer Cutting Machine For PCB, IR Filter,
Sapphire Glass And Ceramic
Features of products
• Using touching LCD to operate. The interface design is simple and
easy. Provide a variety of languages such as Chinese, English,
Korean, etc.
• Can meet the high precision cutting maximum diameter of 300 mm
materials.
• High rigidity structure design is adopted to ensure high
precision and high stability of cutting process.
•Cutting spindle: 2.4 kw × 1set (Max: 60,000 rpm)
•Repeat positioning accuracy : 0.001mm
•Cutting speed: 0.05 ~ 400 mm/sec
•Standard collocation of using blade size:2 Inch (Max:3 Inch)
• CCD automatic align.
• Real-time monitoring system of air pressure, water
pressure,current, etc., to avoid damage to the air spindle.
x-axis
Working stroke | 340MM |
cutting speed | 0.05 ~ 400mm/sec |
resolution | 0.0001MM |
y-axis
Working stroke | 310MM |
resolution | 0.0001MM |
Repeat positioning accuracy | 0.001 / 310MM |
z-axis
Working stroke | 60 (2 InchBlade)mm |
resolution | 0.0001mm |
Θ-axis
Angle of rotation | 360deg |
Specifications:
Dimensions of processing | Φ300mm |
Dimensions of working platform | Φ350mm |
power | 2.4KW |
speed | 5,000 ~ 60,000 rpm |
power supply | 3P , 220 (50 ~ 60 Hz)v |
Power air pressure | 0.5 ~ 0.6 MPa |
Air consumption | 200L/min |
Cutting water consumption | 4.0L/min |
cooling water consumption | 1.5L/min |
(W×D×H) physical dimension | 1040×1080×1750mm |
machine net weight | 850KG |
Features of products
• Using touching LCD to operate. The interface design is simple and
easy. Provide a variety of languages such as Chinese,English,
Korean, etc.
• Feeding, position align, cutting, cleaning / drying and unloading
all automatically completed
• Can meet the high precision cutting maximum diameter of 300 mm
materials.
• Double spindle cutting simultaneously, more than 85% higher than
that of single spindle cutting capacity.
2.4KW 60000rpm Wafer Cutting Machine For PCB
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