Compact Structure Vertical Solder Reflow Oven S SERIES Total power 45KW

Brand Name:YUSH
Certification:CE Mark
Model Number:YSL-200S
Minimum Order Quantity:1 set
Delivery Time:3 days to 7 days
Payment Terms:L/C, D/A, D/P, T/T, Western Union, MoneyGram
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Verified Supplier
Location: Suzhou Jiangsu China
Address: Building H, GuoRui Pioneering Park, No. 1068 Jinyang East Road, Lujia Town, Kunshan, Suzhou,Jiangsu,China.
Supplier`s last login times: within 48 hours
Product Details Company Profile
Product Details

In-line vertical reflow oven, with compact structure, small space occupying which greatly saves building space; high production efficiency which is much higher than the traditional oven, especially for the products which needs long time heating in the oven and it effectively improves the production capacity. The demand for the vertical reflow oven is larger and larger; the vertical type instead of the traditional curing oven has become a trend.



Advantages:

1. Effectively improve the capacity

2. Enhance the curing quality

3. Small occupying area and save the workshop space

4. Lower the use-cost


S SERIES Specification
ModelYSL-200SYSL-300SYSL-400SRemarks
Machine DimensionL2140xW1800xH2150mmL2390xW1870xH2150mmL2870xW2010xH2150mm
Machine WeightApprox.1600kgApprox.1800kgApprox.2000kg
Product sizeMAX:W250*L320mmMAX:W320*L410mmMAX:W460*L530mm
Inlet height900±20mm
Storage typeVertical storage
Storage quantityMax product storage number:60pcsCan be customized
Pitch heightIntegral multiple of 25.4mmCan be customized
Temperature rangeRoom temp~200℃
Warming up timeApprox.15minSet temp 150℃
Running powerAbout 6KW
Total power45KW
Temperature control accuracy±1℃
Abnormal alarm3-color signal lamp + Human-machine interface prompt
Power supply3P5L 380V 50/60Hz


Double lifting system, great quantity of storage space,can meet the high efficiency production



Adopts high accuracy step motor for buffer and push structure, ensure the pushing accuracy



PCB conveying detection in the oven adopts imported fiber optic sensor which greatly ensure the operation reliability.


Main application: Chip bonding, under fill, components packing and other production process which needs thermo curing. (Include automobile, motor, instrument, communication and other industries)


China Compact Structure Vertical Solder Reflow Oven S SERIES Total power 45KW supplier

Compact Structure Vertical Solder Reflow Oven S SERIES Total power 45KW

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