ENIG Finished 3 OZ Copper PCB Lead Free Soldering PCB Board Assembly services

ENIG Finished 3 OZ Copper PCB Lead Free Soldering PCB Board Assembly services

Specifications

1. Layer: 2 Layer
2. Material: FR-4
3. Board Thickness: 2.0mm
4. Surface Treatment: Lead Free HASL
5. Solder Mask: Green
6. Size: 87.22mm x 65.86mm
7. Copper Thickness: 3OZ
8. Min. Line Spacing: 0.3mm
9. Min Trace Space: 0.3mm

PCB capability and services:

1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)
2. Flexible PCB (up to 10 layers)
3. Rigid-flex PCB (up to 8 layers)
4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test

PCBA capabilities:

Single- or double-sided mixed technology or SMT (Surface Mount) for PCB assembly

ROHS capability

IPC-A-610E and IPC/EIA-STD workmanship operation


Quality Assurance:

ISO9001 and ISO/TS16949 management systems
Lean production system
ERP and PTS system support for management

Quality Processes:

1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection (FAI) for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949

Testing Methods

AOI Testing
Checks for solder paste
Checks for components down to 0201"
Checks for missing components, offset, incorrect parts, polarity

X-Ray Inspection
X-Ray provides high-resolution inspection of:
BGAs
Bare boards

In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by

component problems.
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing

Factory View: