0.2mm C19400 Copper Based Alloy Foil For Semiconductor Chip Lead Frame

Brand Name:OHMALLOY
Certification:SGS
Model Number:C19400
Minimum Order Quantity:20kg
Place of Origin:China
Price:30USD/KG
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Location: Shanghai Shanghai China
Address: Room 311, No.1211, Mudanjiang Road, Baoshan district, Shanghai
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Product Details

0.2mm thick C19400 foil for semiconductor chip lead frame

The remarkable characteristics of the material are: high strength, high conductivity, high precision and high softening temperature resistance, as well as suitable processing properties and electroplating brazing properties.

It is mainly used for the production of semiconductor chip lead frame, integrated circuit and electronic discrete devices, electronic industry connectors, etc.

Standard:

GB/TDINENASTMJIS
QFe2.5

CuFe2P

2.1310

CuFe2P

CW107C

C19400C19400

Chemical composition:

CuBal.
Fe2.1-2.6
Zn0.05-0.2
P0.015-0.15


Physical property:

Density(g/cm3)8.9
Conductivity IACS% {(20℃)}60min
Modulus of elasticity(KN/mm2)121
Thermal conductivity {W/(m*K)}280

Coefficient of thermal expansion

(10-6/℃ 20/℃ ~100/℃)

17.7

StatusTensile strengthYield strengthElongation A50HardnessBending test
90°(R/T)
(Rm,MPa)(Rp0.2,MPa)(%)(HV)GWBW
R300300-340240max20min80-10000
R340340-390240min10min100-12000
R370370-430330min6min120-14000
R420420-480380min3min130-1500.50.5
R470470-530440min4min140-1600.50.5
R530530-570470min5min150-1701

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China 0.2mm C19400 Copper Based Alloy Foil For Semiconductor Chip Lead Frame supplier

0.2mm C19400 Copper Based Alloy Foil For Semiconductor Chip Lead Frame

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