Recycled Solderless Breadboard Projects General Insulation Thickness

Recycled Solderless Breadboard Projects General Insulation Thickness

Specifications:

• Number of holes: 25 holes
• Layers: Single
• Insulation Material: Plastic (ABS)
• Insulation Thickness: General
• Reinforcing material: composite base
• Seven colors

Features:

• Can be recycled, recycling
• Structure colors clear and easy to use
• Breadboard assembly units can be fixed

Purpose:

• Experiment, testing, robotics, and mini breadboard floor with better results.

More Information:

Image:

Tie-point 25

Cixi Zhongyi Electronic Equipment Factory is engaged in the R&D and production of universal breadboard, PCB board, and jumper wire. Since the factory was established, our business spreads in multiple fields, such as education, scientific research and consuming electronics. With excellent quality and good price, we get recognitions from customers. Our products are more and more popular all world widely.

We are devoted to doing experiments to produce various types of products. In this way, customers can have more choices. And, in order to serve customers better, we accept ODM and OEM.

"High quality, fine service, smooth development" are our business philosophy, and "product, technology, service" are the three key cornerstones of factory’s development. At the same time, in order to achieve the goal of combining industry and trade, we need to know the importance of the service for a splendid business. Customer satisfaction is the most important measure of standard for each sector and employee in our company. All of our employees will try their best to innovate and serve for the customer.

ZHONGYI ELECTRONI upholds the concept that " not for the best, but for better.!" To improve our employees’ service, we constantly improve our internal management by organizing technical trainings . And we also adhere to the "quality assurance, service-oriented" sales commitments and continue to supply the customers with strong technical strength and service system.