Telecommunication garnet Hardware Thermal Conductive Pad 6.2 W / mK , High Thermal sillicone rubber Pad
Brand Name:ZIITEK
Certification:UL and RoHs
Model Number:TIF™600 Series
Minimum Order Quantity:1000pcs
Delivery Time:3-5 work days
Place of Origin:China
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Dongguan Guangdong China
Address:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, 523460 Dongguan City
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Product Details
Telecommunication garnet Hardware Thermal Conductive Pad 6.2 W / mK
, High Thermal sillicone rubber Pad
The TIF™600G Series thermally conductive interface materials are applied to fill the
air gaps between the heating elements and the heat dissipation fins
or the metal base. Their flexibility and elasticity make them
suited to the coating of the very uneven surfaces. Heat can
transmit to the metal housing or dissipation plate from the
separate elements or even the entire PCB, which in effect enhances
the efficiency and life-time of the heat-generating electronic
components.
Features
> Good thermal conductive: 6.2 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
Applications
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
Typical Properties of TIF™600G Series | ||||
Color | Garnet | Visual | Composite Thickness | Thermal Impedance@10psi (℃-in²/W) |
Construction & Compostion | Ceramic filled silicone rubber | *** | 10mils / 0.254 mm | 0.16 |
20mils / 0.508 mm | 0.20 | |||
Specific Gravity | 2.85 g/cc | ASTM D297 | 30mils / 0.762 mm | 0.31 |
40mils / 1.016 mm | 0.36 | |||
Heat Capacity | 1 l/g-K | ASTM C351 | 50mils / 1.270 mm | 0.42 |
60mils / 1.524 mm | 0.48 | |||
Hardness | 50 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.53 |
80mils / 2.032 mm | 0.63 | |||
Tensile Strength | 55 psi | ASTM D412 | 90mils / 2.286 mm | 0.73 |
100mils / 2.540 mm | 0.81 | |||
Continuos Use Temp | -50 to 200℃ | *** | 110mils / 2.794 mm | 0.86 |
120mils / 3.048 mm | 0.93 | |||
Dielectric Breakdown Voltage | >10000 VAC | ASTM D149 | 130mils / 3.302mm | 1.00 |
140mils /3.556 mm | 1.08 | |||
Dielectric Constant | 4.5 MHz | ASTM D150 | 150mils / 3.810 mm | 1.13 |
160mils / 4.064 mm | 1.20 | |||
Volume Resistivity | 3.2X1012 Ohm-meter | ASTM D257 | 170mils / 4.318 mm | 1.24 |
180mils / 4.572 mm | 1.32 | |||
Fire rating | 94 V0 | equivalent UL | 190mils / 4.826 mm | 1.41 |
200mils / 5.080 mm | 1.52 | |||
Thermal conductivity | 6.2 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Telecommunication garnet Hardware Thermal Conductive Pad 6.2 W / mK , High Thermal sillicone rubber Pad
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