High Performance Compressible Non - Silicone Thermal Pad 2.65 G/Cc 1mm
Brand Name:ZIITEK
Certification:UL and RoHs
Model Number:Zpaster140-20-11F
Minimum Order Quantity:1000pcs
Delivery Time:3-5 days
Place of Origin:China
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Location:
Dongguan Guangdong China
Address:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, 523460 Dongguan City
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within 1 hours
Product Details
Company Profile
Product Details
No silicone material thermal gap pad Zpaster140-20-11F 2w silicone-free thermal pad 2.65 g/cc 1mmT for battery
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Zpaster140-20-11F is a high performance and compatible non-silicone material of the thermal conductive interface materials.The role is to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.
It applies to the liner based on silicone suitably. The flexibility and elasticity make it suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Features
>Silicone-free
>ROSH compliance
>Good thermal conductive:2.0 W/mK
>Soft and Compressible for low stress applications
>Available in varies thickness
Application
>Car Battery & Power Supply
>Charging Pile
>Silicone-sensitive applications
>Graphics Card Thermal Module
>Set Top Box
> Medical devices
>LED Lighting
>SFP optical module
| Typical Properties of Z-Paster140-20-11F Series | ||||||
| Color | Dark grey | Visual | Dielectric Breakdown Voltage (T= 1mm above) | >5000 VAC | ASTM D149 | |
| Construction | Silicone-free The metal oxide fills | ********** | Dielectric Constant | 5.5 MHz | ASTM D150 | |
| Thermal Conductivity | 2.0 W/mK | ASTM D5470 | Volume Resistivity | 6.0X1013 Ohm-meter | ASTM D257 | |
| Hardness | 65 Shore 00 | ASTM 2240 | Continuous Use Temp | – 20 To 125 ℃ | ********** | |
| Specific Gravity | 2.65 g/cc | ASTM D297 | Outgassing (TML) | 0.30% | ASTM E595 | |
| Thickness range | 0.010"-0.200" (0.25mm-5.0mm) | ASTM D374 | Flame Rating | 94 V0 | equivalent to | |
Standard size
0.010-inch to 0.200-inch (0.25mm to 5.0mm)
Options
Proprietary NS1 option available to eliminate tack from one side to aid in handling.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
4.兆科文化
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
High Performance Compressible Non - Silicone Thermal Pad 2.65 G/Cc 1mm
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