Stability Silicone Thermal Gap Filler 3.05g/cc Grey Putty -45-200 ℃ 94-V0 For LED Backlight Module
Brand Name:ZIITEK
Certification:UL and RoHs
Model Number:TIF050-11
Minimum Order Quantity:1000tube
Delivery Time:7-15work days
Place of Origin:China
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Location:
Dongguan Guangdong China
Address:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, 523460 Dongguan City
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Product Details
Stability Silicone Thermal Gap Filler 3.05g/cc Grey Putty -45-200 ℃ 94-V0 For LED Backlight Module
TIF050-11 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF050-11 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.
TIF050-11 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF050-11 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component .
TIF050-11 Series Datasheet-REV02.pdf
Application
>Heat-sink & frame
>LED backlight module,LED lighting
>High speed hardware driver
>Micro heat pipe ,Vihicel enginee controler
>Telecom industry
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
Feature
>Thermal conductivity: 5W/mK
>Soft, very low compression
>Operate automaticly
>Soft and Compressible for low stress applications
| TIFTM050-11 Property | |||
| Color | Gray | Visual | |
| Construction & Composition | Ceramic filled silicon material | ********** | |
| Viscosity | 2000,000cps | GB/T 10247 | |
| Specific Gravity | 3.05 g/cc | ASTM D297 | |
| Thermal conductivity | 5.0 W/mK | ISO 22007-2 | |
| Thermal diffusivity | 1.695 mm2/s | ISO 22007-2 | |
| Specific heat capacity | 2.3 MJ/m3K | ISO 22007-2 | |
| Continuous Use Temperature | -45 ~200°C | ****** | |
| Dielectric breakdown strength | 200 V/mil | ASTM D149 | |
| Flame Rating | 94V0 | E331100 | |
| Outgassing,%TML | 0.60% | ASTM E595 | |
Package :
•30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box
We offer the custom packaged in syringes for automated despensing applications.Please contact us for confirming.
Stability Silicone Thermal Gap Filler 3.05g/cc Grey Putty -45-200 ℃ 94-V0 For LED Backlight Module
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