Silicone Free Gap Filler Pad Thermally Conductive Gap Filler For PCB Heat Sinking
Brand Name:ZIITEK
Certification:UL and RoHs
Model Number:Zpaster180-20-11F
Minimum Order Quantity:1000pcs
Delivery Time:3-5 days
Place of Origin:China
Contact Now
Add to Cart
Verified Supplier
Location:
Dongguan Guangdong China
Address:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, 523460 Dongguan City
Supplier`s last login times:
within 1 hours
Product Details
Company Profile
Product Details
Silicone Free Gap Filler Pad Thermally Conductive Gap Filler For PCB Heat Sinking
Company Profile
Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
Z-paster180-20-11F is a high performance and compatible non-silicone material of the thermal conductive interface materials.The role is to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.
It applies to the liner based on silicone suitably. The flexibility and elasticity make it suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Z-Paster100-20-11F Series Datasheet-(E)-REV01.pdf
Features
>Silicone-free
>ROSH compliance
>Good thermal conductive:2.0 W/mK
>Soft and Compressible for low stress applications
>Available in varies thickness
Application
>Cooling components to the chassis of frame
>Display card
>Mainboard/mother board
>Notebook
>Power supply
>Heat pipe thermal solutions
>Memory Modules
>Mass storage devices
>Automotive electronics
| Typical Properties of Z-Paster180-20-11F Series | ||||||
| Color | Dark Gray | Visual | Dielectric Breakdown Voltage (T= 1mm above) | >5000 VAC | ASTM D149 | |
| Construction | Silicone-free The metal oxide fills | ********** | Dielectric Constant | 5.5 MHz | ASTM D150 | |
| Thermal Conductivity | 2.0 W/mK | ASTM D5470 | Volume Resistivity | 6.0X1013 Ohm-meter | ASTM D257 | |
| Hardness | 65 Shore 00 | ASTM 2240 | Continuous Use Temp | – 20 To 125 ℃ | ********** | |
| Specific Gravity | 2.68 g/cc | ASTM D297 | Outgassing (TML) | 0.30% | ASTM E595 | |
| Thickness | 2mmT | ASTM D374 | Flame Rating | 94 V-0 | equivalent to | |
Standard size
0.010-inch to 0.200-inch (0.25mm to 5.0mm)
Options
Proprietary NS1 option available to eliminate tack from one side to aid in handling.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Silicone Free Gap Filler Pad Thermally Conductive Gap Filler For PCB Heat Sinking
Inquiry Cart
0