1.25W/mK Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink
Brand Name:ZIITEK
Certification:UL and RoHs
Model Number:TIF™200-02E
Minimum Order Quantity:1000pcs
Delivery Time:3-5 work days
Place of Origin:China
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Verified Supplier
Location:
Dongguan Guangdong China
Address:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, 523460 Dongguan City
Supplier`s last login times:
within 1 hours
Product Details
Company Profile
Product Details
1.25W/mK Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink
The TIF™200-02E Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink..
Features
> Good thermal conductive
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
Applications
> Monitoring the Power Box
> AD-DC Power Adapters
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
| Typical Properties of TIF200-02E Series | ||
| Color | Gray / White | Visual |
| Construction Reinforcement Carrier | Ceramic filled silicone elastomer | ********** |
| Thermal Conductivity | 1.25 W/mK | ASTM D5470 |
| Hardness | 35 Shore 00 | ASTM 2240 |
| Specific Gravity | 2.2g/cc | ASTM D297 |
| Thickness range | 0.020"-0.200" (0.5mm-5.0mm) | ASTM D374 |
| Dielectric Breakdown Voltage (T= 1mm above) | >5500 VAC | ASTM D149 |
| Dielectric Constant | 4.0MHz | ASTM D150 |
| Volume Resistivity | 1.0X10¹² Ohm-meter | ASTM D257 |
| Continuous Use Temp | – 40 To 160 ℃ | ********** |
| Outgassing (TML) | 0.35% | ASTM E595 |
| Flame Rating | 94 V0 | UL E331100 |
Product Thicknesses
0.010-inch to 0.200-inch(0.5mm to 5.0mm)
Product Sizes
8" x 16""(203mm x406mm)
lndividual die cut shapesand and custom thickness can be supplied.
Please contact us for confirming
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
1.25W/mK Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink
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