Silicone Thermal Conductive Laptop CPU Thermal Pad High Voltage Thermal Gap Filler For Electronic Components

Brand Name:ZIITEK
Certification:UL and RoHs
Model Number:TIF700NUS
Minimum Order Quantity:1000pcs
Delivery Time:3-5work days
Place of Origin:China
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Verified Supplier
Location: Dongguan Guangdong China
Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, 523460 Dongguan City
Supplier`s last login times: within 1 hours
Product Details Company Profile
Product Details

Silicone Thermal Conductive Laptop CPU Thermal Pad High Voltage Thermal Gap Filler For Electronic Components​


TIF®700NUS series of thermal interface materials is specficlly designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, allowing it to conform tighty to heat sources with varying shapes and height differences. Even in confined or irregular spaces,it maintains stable thermal conductivity, enabling eficient heat transfer from discrete components or the entire PCB to the metal housing or heat sink. This significantly improves the heat dissipation efficiency ofelectronic components, thereby enhancing operational stability and extending device lifespan.


Features:


> Excellent thermal conductivity: 6.5 Wm-K

> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressureapplication environments
> Available in different thickness options


Applications:


> Heat dissipation structure for radiators

> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles

> LED drivers and lamps

Typical Properties of TIF®700NUS Series
ColorGrayVisual
Construction & CompostionCeramic filled silicone elastomer******
Specific Gravity3.5g/ccASTM D297
thickness0.020"(0.50mm)~0.200"(5.00mm)ASTM D374
Hardness (thickness<1.0mm)20 (Shore 00)ASTM 2240
Continuos Use Temp-45 to 200℃******
Dielectric Breakdown Voltage>6000 VACASTM D149
Dielectric Constant

4.5MHz

ASTM D150
Volume Resistivity≥1.0X10¹²Ohm-meterASTM D257
Fire rating94 V0equivalent UL
Thermal conductivity6.5W/m-KASTM D5470
Product Specification
Product Thicknesses: 0.02"(0.50mm)-0.200"(5.00mm)
Product Sizes:16" x 16"(406mm x406mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1(Single-sided hardening).
Adhesive Options: A1/A2(Single-sided/Double-sided adhesive).
Notes:FG (Fiberglass) provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25to 0.5mm).
The TIF series is available in custom shapes and various forms.For other thicknesses or more information, please contact us.
Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.


Why Choose us ?


1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract


FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.


Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.


Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

China Silicone Thermal Conductive Laptop CPU Thermal Pad High Voltage Thermal Gap Filler For Electronic Components supplier

Silicone Thermal Conductive Laptop CPU Thermal Pad High Voltage Thermal Gap Filler For Electronic Components

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