Automotive Radar Detector High Frequency PCB Manufacturing Process With Sensor Module

Brand Name:XCE
Certification:CE,ROHS, FCC,ISO9008,SGS,UL
Model Number:XCEH
Minimum Order Quantity:1pcs
Delivery Time:5-10 days
Payment Terms:T/T,Western union
Contact Now

Add to Cart

Site Member
Location: Shenzhen Guangdong China
Address: Room 403 Block A,Huafeng SOHO Creative World Hangcheng Industrial Zone Qianjin 2nd Road,Xixiang Baoan Shenzhen,China
Supplier`s last login times: within 27 hours
Product Details Company Profile
Product Details

Automotive Radar Detector High Frequency PCBs With Sensor Module


Specification:



Board size: 32*16 cm


Board thickness: 0.2mm


Copper foil: 50UM


Layer: 4


Parameter:


F4BF4B0.382.2
F4B0.552.23
F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
F4Bk0.8,1.52.65
F4B0.83.5
FE=F4BM12.2

Description:


High frequency PCBs with aluminum heat sink for telecommunication and aerospace industries using customer specific electrically and thermally conductive bonding films. Microwave PCB’s: XCE has enormous experience and technical expertise in the manufacturing of time critical, high technology RF circuits. The company works closely with its worldwide customers to deliver prototype-to-large volume manufacturing of circuits. During this process our engineering staff discusses with the customers’ staff to come up with the optimized designs for high quality, low cost and speedy delivery.


Max panel size508*610mm
Board thickness tolerance  T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness  >0.025mm(1mil)
Finished hole0.2mm-6.3mm
Min line width4mil/4mil(0.1/0.1mm)
Min bonding pad space0.1mm(4mil)
PTH aperture tolerance±0.075mm(3mil)

China Automotive Radar Detector High Frequency PCB Manufacturing Process With Sensor Module supplier

Automotive Radar Detector High Frequency PCB Manufacturing Process With Sensor Module

Inquiry Cart 0