Product Details
Advanced High Speed RF PCB Material Electronic Circuit Boards
Specification:
Radio frequency (RF) and microwave PCB’s are a type of PCB designed
to operate on signals in the megahertz to gigahertz frequency
ranges (medium frequency to extremely high frequency).
These frequency ranges are used for communication signals in
everything from cellphones to military radars. The materials used
to construct these PCB’s are advanced composites with very specific
characteristics for dielectric constant (Er), loss tangent, and CTE
(co-efficient of thermal expansion).
High frequency circuit materials with a low stable Er and loss
tangent allow for high speed signals to travel through the PCB with
less impedance than standard FR-4 PCB materials. These materials
can be mixed in the same Stack-Up for optimal performance and
economics.
Features
- CTEr = +40/+50 ppm per °C (low); Tg (glass transition temperature)
is 280°C
- ER = 3.38/3.48 at 10.0 GHz
- ER is constant to 40.0 GHz
- ED (electro-deposited) copper only
- Layer-to-layer thickness control = +/- 0.001
- Fabrication costs are typical to slightly increased
Parameter:
o | Item | Data |
1 | Layer: | 1 to 24 layers |
2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
3 | Board thickness: | 0.20mm to 3.4mm |
4 | Copper thickness: | 0.5 OZ to 4 OZ |
5 | Copper thickness in hole: | >25.0 um (>1mil) |
6 | Max. Board Size: | (580mm×1200mm) |
7 | Min. Drilled Hole Size: | 4mil(0.1mm) |
8 | Min. Line Width: | 3mil (0.075mm) |
9 | Min. Line Spacing: | 3mil (0.075mm) |
10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion
Silver/Gold, OSP, Gold plating |
11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue |
12 | Shape tolerance: | ±0.13 |
13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 |
14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard
carton packing |
15 | Certificate: | UL,SGS,ISO 9001:2008 |
16 | Special requirements: | Buried and blind vias+controlled impedance +BGA |
17 | Profiling: | Punching, Routing, V-CUT, Beveling |
Company Profile
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing
various of printed circuit boards.
We have accumulated abundant experiences in the line of high
frequency microwave business for which widely apply to power
divider,combiner,power amplifier,line amplifier,base station,RF
antena,4G antena so on and so forth. Our company's sufficient
stocks of hi-frequency pcb materials such as
Rogers,TACONIC,Arlon,Isola,F4B,TP-2,FR-4 (dielectric rage:2.2-16)
mainly used in the area of high technologies like communication
device,Electronics,Aerospace,Military industry to meet our
worldwide customers with high quality. Furthermore,we also keen on
helping customers shorten the period of production development and
24 hours of sample service is available.
Since the day of company foundation we continuously engaged in
researching special and high precision printed circuit boards with
the strong production capability of 2 to 28 layers of highly
precise impedence,multi-layer blind buried,multi-layer
mix-compression,high TG, copper substrate,Ceramic substrate PCB. We
emphasize the significance of traning program for every single
staff in the company even grass-roots employees which becomes the
most competitive factors to excel from others,our company have many
experienced and professional teams from management to production
line,30% are highly educated among the total amount of
employees,advanced engineers and senior technicians are up to 80
people.
With advanced foreign technology supports and domestic 3G/4G device
manufacturer in microwave pcb field which lead our experienced
hi-frequency researching team to one step ahead of the line of
printed circuit board business,we are honored to obtain sound
reputations over our worldwide customers on the basis of fine
qulity,prompt delivery,satisfied after sales service for may years
and we assure our customers that we will return the favors with
more and more superior products in the near future.