Product Details
Multilayer High Frequency PCB Induction Cooker PCB Sensor PCB Mass
Production
Quick Detail :
1. Type : Pcb
2. Material : Rogers
3. Layer : Multilayer
4. Products Size :11*8cm
5. Permittivity : 2.5
6. Surface finish : Immersion Gold
Features:
1. Rogers pcb multilayer pcb with high frequency can improvide the
products quality ,with high techolonogy treatment improve the life
cycle of the products .
2. Immersion gold surface finish make the pcb 's conductive
performance enhancements.
3. Multilayer pcb design ,the precision of the pcb improves much
more better .
4. Low dielectric : 2.5 dielectric conductivity much more precision
.
Parameter:
Model | Parameter | thickness(mm) | Permittivity(ER) |
F4B | F4B | 0.38 | 2.2 |
F4B | 0.55 | 2.23 |
F4B | 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 | 2.65 |
F4Bk | 0.8,1.5 | 2.65 |
F4B | 0.8 | 3.5 |
FE=F4BM | 1 | 2.2 |
Rogers | RO5880 | 0.254 0.508 0.762 | 2.20 ± 0.02 |
RO4350 | 0.254 0.508,0.8,1.524 | 3.5 |
RO4003 | 0.508 | 3.38 |
TACONIC | TLF-35 | 0.8 | 3.5 |
TLA-6 | 0.254,0.8,1,1.5, | 2.65 |
TLX-8 | 0.254,0.8,1,1.6 | 2.55 |
RF-60A | 0.64 | 6.15 |
TLY-5 | 0.254,0.508,0.8 | 2.2 |
TLC-32 | 0.8,1.5,3 | 3.2 |
TLA-35 | 0.8 | 3.2 |
ARLON | AD255C06099C | 1.5 | 2.55 |
MCG0300CG | 0.8 | 3.7 |
AD0300C | 0.8 | 3 |
AD255C03099C | 0.8 | 2.55 |
AD255C04099C | 1 | 2.55 |
DLC220 | 1 | 2.2 |
Description :
RO3006™ and RO3010™ Laminates
RO3006™ and RO3010™ laminates ceramic-filled PTFE composites
intended for use in commercial microwave and RF applications. This
family of products was designed to offer exceptional electrical and
mechanical stability at competitive prices.
These laminates offer excellent stability of dielectric constant
over temperature including the elimination of the step change in
dielectric constant, which occurs near room temperature with PTFE
glass materials. Additionally, RO3006™ and RO3010™ exhibits a low
dissipation factor of 0.0020 at 10 GhZ for RO3006 laminates and
0.0022 at 10 GhZ for RO3010 laminates.
A higher dielectric constant (6.15) when compared to RO3003.
PrePreg Material
It announced TerraGreen, a halogen-free, ultra-low loss,
RF/microwave/high-speed material. TerraGreen is engineered for such
high-performance applications as power amplifier boards for 4G LTE
base stations.
Benefits:
- Lowest loss commercial laminates (RO3003)
- Are available in a wide range of Dk (dielectric constant) (3.0 to
10.2)
- Are available both with and without woven glass reinforcements
- Low Z-axis CTE (24 ppm/C) provides plated through hole reliablity
- Low TCDk for electrical stablity versus temperature (RO3003)
Typical Applications:
- Automotive radar applications
- Global positioning satellite antennas
- Cellular telecommunications systems - power amplifiers and antennas
- Patch antenna for wireless communications
- Direct broadcast satellites
- RFID Tags
- Surface mount RF components
- E-Band point to point microwave links
Production Description :
Parameter | Value | Specific gravity/density | 1.850 g/cm3 (3,118 lb/cu yd) | Water absorption | −0.125 in < 0.10% | Temperature index | 140 °C (284 °F) | Thermal conductivity, through-plane | 0.29 W/(m·K),[1] 0.343 W/(m·K)[2] | Thermal conductivity, in-plane | 0.81 W/(m·K),[1] 1.059 W/(m·K)[2] | Rockwell hardness | 110 M scale | Bond strength | > 1,000 kg (2,200 lb) | Flexural strength (A; 0.125 in) - LW | > 440 MPa (64,000 psi) | Flexural strength (A; 0.125 in) - CW | > 345 MPa (50,000 psi) | Tensile strength (0.125 in) LW | > 310 MPa (45,000 psi) | Izod impact strength - LW | > 54 J/m (10 ft·lb/in) | Izod impact strength - CW | > 44 J/m (8 ft·lb/in) | Compressive strength - flatwise | > 415 MPa (60,200 psi) | Dielectric breakdown (A) | > 50 kV | Dielectric breakdown (D48/50) | > 50 kV | Dielectric strength | 20 MV/m | Relative permittivity (A) | 4.8 | Relative permittivity (D24/23) | 4.8 | Dissipation factor (A) | 0.017 | Dissipation factor (D24/23) | 0.018 | Dielectric constant permittivity | 4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz | Glass transition temperature | Can vary, but is over 120 °C | Young's modulus - LW | 3.5×106 psi (24 GPa) | Young's modulus - CW | 3.0×106 psi (21 GPa) | Coefficient of thermal expansion - x-axis | 1.4×10−5 K−1 | Coefficient of thermal expansion - y-axis | 1.2×10−5 K−1 | Coefficient of thermal expansion - z-axis | 7.0×10−5 K−1 | Poisson's ratio - LW | 0.136 | Poisson's ratio - CW | 0.118 | LW sound speed | 3602 m/s | SW sound speed | 3369 m/s |
|
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.
Company Profile
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing
various of printed circuit boards.
We have accumulated abundant experiences in the line of high
frequency microwave business for which widely apply to power
divider,combiner,power amplifier,line amplifier,base station,RF
antena,4G antena so on and so forth. Our company's sufficient
stocks of hi-frequency pcb materials such as
Rogers,TACONIC,Arlon,Isola,F4B,TP-2,FR-4 (dielectric rage:2.2-16)
mainly used in the area of high technologies like communication
device,Electronics,Aerospace,Military industry to meet our
worldwide customers with high quality. Furthermore,we also keen on
helping customers shorten the period of production development and
24 hours of sample service is available.
Since the day of company foundation we continuously engaged in
researching special and high precision printed circuit boards with
the strong production capability of 2 to 28 layers of highly
precise impedence,multi-layer blind buried,multi-layer
mix-compression,high TG, copper substrate,Ceramic substrate PCB. We
emphasize the significance of traning program for every single
staff in the company even grass-roots employees which becomes the
most competitive factors to excel from others,our company have many
experienced and professional teams from management to production
line,30% are highly educated among the total amount of
employees,advanced engineers and senior technicians are up to 80
people.
With advanced foreign technology supports and domestic 3G/4G device
manufacturer in microwave pcb field which lead our experienced
hi-frequency researching team to one step ahead of the line of
printed circuit board business,we are honored to obtain sound
reputations over our worldwide customers on the basis of fine
qulity,prompt delivery,satisfied after sales service for may years
and we assure our customers that we will return the favors with
more and more superior products in the near future.