HDI High Level Fr4 PCB Printed Circuit Boards With 0.1mm Hole

Brand Name:XCE
Certification:CE,ROHS, FCC,ISO9008,SGS,UL
Model Number:PCB printed circuit boards
Minimum Order Quantity:1pcs
Delivery Time:5-10 days
Payment Terms:T/T,Western union
Contact Now

Add to Cart

Site Member
Location: Shenzhen Guangdong China
Address: Room 403 Block A,Huafeng SOHO Creative World Hangcheng Industrial Zone Qianjin 2nd Road,Xixiang Baoan Shenzhen,China
Supplier`s last login times: within 27 hours
Product Details Company Profile
Product Details

HDI High Level Fr4 PCB Printed Circuit Boards With 0.1mm Hole


Quick detail:

Name:PCB printed circuit boards
Layer:6
Size:5*8CM

Specification:

4 Layer Black Soldermask Immersion Gold High TG PCB Board In Panel Format

FR-4 material is a fire code rating, represents a material specification is meant a resin material through the combustion state must be self-extinguishing, it is not a material name, but a material grade. So now FR-4 grade material is typically used in circuit boards, there are many species, but most are based on the so-called four-function (Tera-Function) plus epoxy filler (Filler) and glass fiber made composite materials.


Defined impedance 4 layer black soldermask immersion gold board is: a good laminated structure will be able to play on the printed circuit board characteristic impedance control, the traces can be formed easily controlled and predictable transmission line structure is called impedance plate.


Current common characteristic impedance is divided into: single-ended (line) impedance differential (fixed) impedance coplanar impedance.

Single-ended (wire) Impedance: English single ended impedance, refers to a single signal line measured impedance.

Difference (Fixed) Impedance: English differential impedance, differential drive means to the test in two monospaced equally spaced transmission line impedance.


XCE PCB technical specification
Annual stock meterialRogers,Taconic,Arton,Isola,F4B,TP-2,FR4,High TG,Halogen free
Layer No.1-16
Min board thickness2 layer 0.2mm
4 layer 0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
Max panel size508*610mm
Board thickness tolerance  T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness  >0.025mm(1mil)
Finished hole0.2mm-6.3mm
Min line width4mil/4mil(0.1/0.1mm)
Min bonding pad space0.1mm(4mil)
PTH aperture tolerance±0.075mm(3mil)
NPTH aperture tolerance±0.05mm(2mil)
Hole site deviation±0.05mm(2mil)
Profile tolerance±0.10mm(4mil)
Board bend&warp≤0.7%
Insulation resistance>1012Ωnormal
Through-hole resistance<300Ωnormal
Electric strength>1.3kv/mm
Current breakdown10A
Peel strength1.4N/mm
Soldmask regidity>6H
Thermal stress288℃20Sec
Testing voltage50-300v
Min buried blind via0.2mm(8mil)
Outer cooper thickness1oz-5oz
Inner cooper thickness1/2 oz-4oz
Aspect ratio8:1
SMT min green oil width0.08mm
Min green oil open window0.05mm
Insulation layer thickness0.075mm-5mm
Aperture0.2mm-0.6mm
Special technologyInpedance,blind buried via,thick gold,aluminumPCB
Surface finishHASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating

China HDI High Level Fr4 PCB Printed Circuit Boards With 0.1mm Hole supplier

HDI High Level Fr4 PCB Printed Circuit Boards With 0.1mm Hole

Inquiry Cart 0