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1.6mm Impedance Control PCB Glass Epoxy FR4 PCB Printed Circuit
Board Copper Clad Laminate
Quick detail:
Origin:China | Special: FR4 Material |
Layer:2 | Thickness:1.6mm |
Surface: ENIG | Hole:0.5 |
Specification:
FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as
binder, with electronic level glass fiber cloth as reinforcing
material of substrate. Its bonding sheet and thin copper-clad r.p.
panel and inner core is an important base material in production of
multilayer printed circuit board,This kind of product is mainly
used for double-sided PCB, dosage is very large. Epoxy glass fiber
cloth substrate, the most widely used model for FR - 4, in recent
years because of the electronic product installation technology and
PCB technology development needs, appeared high Tg FR - 4 products.
Following are some types introduction for Rigid PCB and High
Frequency PCB:
FR4 PCB(2layer,4 layer,multilayer)
Rogers(RO4003,RO4350,RO5880,RO3003,RO3010,RO3206,RO3035,RO6010)
F4B high frequency pcb board
Taconic(TLX-8,TLX-9,TLC-32,TLY-5,RF-60A,CER-10,RF-30,TLA-35)
Arlon high frequency pcb board
ISOLA high frequency pcb board
At the same time, we also provide corresponding PCBA services as
our customer’s design and requirement.
Specification:
Layer: 2
Color: Green
Line width: 5mil
Line space: 5mil
Hole: 0.2MM
Typical Application
The mechanical properties of epoxy glass fiber cloth substrate,
size stability, impact resistance, moisture resistant to higher
than paper substrate. Its excellent electrical performance, high
working temperature, itself performance affected by environment. On
the processing technology, than other resin fiberglass cloth
substrate has great superiority
Radio frequency (RF) and microwave PCB’s are a type of PCB designed
to operate on signals in the megahertz to gigahertz frequency
ranges (medium frequency to extremely high frequency). These
frequency ranges are used for communication signals in everything
from cellphones to military radars. The materials used to construct
these PCB’s are advanced composites with very specific
characteristics for dielectric constant (Er), loss tangent, and CTE
(co-efficient of thermal expansion).
High frequency circuit materials with a low stable Er and loss
tangent allow for high speed signals to travel through the PCB with
less impedance than standard FR-4 PCB materials. These materials
can be mixed in the same Stack-Up for optimal performance and
economics.
Parameter:
o | Item | Data |
1 | Layer: | 1 to 24 layers |
2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
3 | Board thickness: | 0.20mm to 3.4mm |
4 | Copper thickness: | 0.5 OZ to 4 OZ |
5 | Copper thickness in hole: | >25.0 um (>1mil) |
6 | Max. Board Size: | (580mm×1200mm) |
7 | Min. Drilled Hole Size: | 4mil(0.1mm) |
8 | Min. Line Width: | 3mil (0.075mm) |
9 | Min. Line Spacing: | 3mil (0.075mm) |
10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue |
12 | Shape tolerance: | ±0.13 |
13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 |
14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
15 | Certificate: | UL,SGS,ISO 9001:2008 |
16 | Special requirements: | Buried and blind vias+controlled impedance +BGA |
17 | Profiling: | Punching, Routing, V-CUT, Beveling |
Features
• High Thermal Performance
Tg: 180°C (DSC)
Td: 340°C (TGA @ 5% wt loss)
Low CTE for reliability
• T260: 60 minutes
• T288: 30 minutes
• RoHS Compliant
• UV Blocking and AOI Fluorescence
High throughput and accuracy during PCB
fabrication and assembly
• Superior Processing
Closest to conventional FR-4 processing
• Core Material Standard Availability
Thickness: 0.002″ (0.05 mm) to 0.125″
(3.2 mm)
Available in full size sheet or panel form
• Prepreg Standard Availability
Roll or panel form
Tooling of prepreg panels available
• Copper Foil Type Availability
Standard HTE Grade 3
RTF (Reverse Treat Foil)
• Copper Weights
½, 1 and 2 oz (18, 35 and 70 μm) available
Heavier copper available upon request
Thinner copper foil available upon request
• Glass Fabric Availability
Standard E-glass
Square weave glass fabric available
Spread glass fabric available
• Industry Approvals
IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
UL - File Number E41625 as PCL-FR-370HR
Qualified to UL's MCIL Program
Rogers material in stock:
Brand | Model | Thickness(mm) | DK(ER) |
F4B | F4B | 0.38 | 2.2 |
F4B | 0.55 | 2.23 | |
F4B | 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 | 2.65 | |
F4Bk | 0.8,1.5 | 2.65 | |
F4B | 0.8 | 3.5 | |
FE=F4BM | 1 | 2.2 | |
Rogers | RO4003 | 0.254 0.508,0.813,1.524 | 3.38 |
RO4350 | 0.254 0.508,0.762,1.524 | 3.5 | |
RO5880 | 0.254.0.508.0.762 | 2.2 | |
RO3003 | 0.127,0.508,0.762,1.524 | 3 | |
RO3010 | 0.635 | 10.2 | |
RO3206 | 0.635MM | 10.2 | |
R03035 | 0.508MM | 3.5 | |
RO6010 | 0.635MM, 1,27MM | 10.2 |
Our company's sufficient stocks as follow:
ROGERS,TACONIC,ARLON,ISOLA,F4B,TP-2,FR-4.
Following are some types introduction for Rigid PCB and High
Frequency PCB:
FR4 PCB(2layer,4 layer,multilayer)
Rogers(RO4003,RO4350,RO5880,RO3003,RO3010,RO3206,RO3035,RO6010)
F4B high frequency pcb board
Taconic(TLX-8,TLX-9,TLC-32,TLY-5,RF-60A,CER-10,RF-30,TLA-35)
Arlon high frequency pcb board
ISOLA high frequency pcb board
At the same time, we also provide corresponding PCBA services as
our customer’s design and requirement.