HF High 150 TG FR4 Material circuit board fabrication With 3 mm Blind Buried Hole Via

Brand Name:XCE
Certification:CE,ROHS,FCC,ISO9008,SGS,UL
Model Number:XCE BK
Minimum Order Quantity:MOQ 1 Piece
Delivery Time:5-10 working days
Payment Terms:T/T, Western Union
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Location: Shenzhen Guangdong China
Address: Room 403 Block A,Huafeng SOHO Creative World Hangcheng Industrial Zone Qianjin 2nd Road,Xixiang Baoan Shenzhen,China
Supplier`s last login times: within 27 hours
Product Details Company Profile
Product Details

HF High 150 TG FR4 Material With 3 mm Blind Buried Hole Via

Products Details


We are the highest efficience pcb manufature here .


(1) Professional Manufacturer on PCB for about 10 years

(2) More than 500 workers, over 4,000 square meters for day-output and 1,000,000 square meters for year-output.

(3) Plant passed passed ISO/TS16949: 2000 and ISO14001: 2004
and products meet IPC-A-600F, IPC-D-600G, MIL-STD-105D LEVEL II, UL and SGS Certification


OME Manufature


a. We manufacture PCB,PCBA,Singe/Double side PCB, Multilayer PCB,Aluminium PCB,Spray Tin PCB,Immersed Gold PCB,HDI Mobilephone PCB,Gold-plating PCB,(printed circuit board with assembly) PCBA,SMT PCBA,DIP PCBA,PCB&PCBA Copy,PCB Assembly,OSP,HASL,etc.

b. Expert circuit board testing, high quality factory wholesale price

c. PCB OEM&ODM Clone/Copy, conform to UL,SGS,RoHS


We offer our customers a wide range material and boards:


1. Single-sided, double-side, multi-layer PCB & Aluminium LED PCB

2. HASL, HAL lead free, OSP, Immersion Gold/ Silver/ Tin surface finish available

3. Base Materials: FR4, High TG FR4,CEM-1, CEM3, Aluminum(metal core)

4. Aluminum PCB board thickness from 0.8mm-3.6mm

5. Quantity from prototype to volume production

6. Fast turnaround time, prompt delivery, high quality at competitive price Detailed Specification of PCB Manufacturing




PrePreg Material

ParameterStandard Spec (mm)
Layer4 L
DHI stack3
Board thinckness3.0
Max work panel size530×610
Aspect ratio12:1
L/S0.07/0.07
Surfce finishOPS,ENIG,Hard gold
MaterialFR-4
Inner packagingVacuum
Solder maskerGreen/ Black/ Red/ Yellow/ White/Blue
Outgoing reportsFinal inspection,solderability test,micro section test ,thermal stresses test and more


Performance characteristics
Glass Transition Temperature (Tg)150Tg or 170Tg
Decomposition Temperature (Td)> 325℃
Coefficient of Thermal Expansion (CTE)3.0%-3.8%
Dielectric Constant (@1 GHz)4.25-4.55
Dielectric Constant (@55 GHz)≤5.5
Dissipation Factor (@ 1 GHz)0.016
Water imbibition (D - 24/23, the thickness of 1.6 mm)≤19mg
Laminate thickness0.005”~ 0.125”
CombustibilityFV0
Density1.70-1.90g/cm&sup3
Vertical Layer To The Bending Strength ANormal :E-1/150,150±5℃≥340Mpa
Parallel To The Floor To The Impact Strength (beam)≥233KJ/m
Execution StandardGB/T1303.1-1998
After Flooding Insulation ResistanceD-24/23):≥5.0×108Ω
Vertical layer to the electric strength (in the middle of 90 + 2 ℃ for transformer oil, thickness 1 mm)≥14.2MV/m
Parallel layer to the breakdown voltage (90 + 2 ℃ in the transformer oil)≥40KV

Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .


What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

China HF High 150 TG FR4 Material circuit board fabrication With 3 mm Blind Buried Hole Via supplier

HF High 150 TG FR4 Material circuit board fabrication With 3 mm Blind Buried Hole Via

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