RF Rogers Material ER 3.38 0.5 mm 0.5 OZ Pcb Assembly With Silkscreen Peeelable Mask For Wilreless Gateway
Brand Name:XCE
Certification:CE,ROHS,FCC,ISO9008,SGS,UL
Model Number:XCE WTO
Minimum Order Quantity:MOQ 1 Piece
Delivery Time:5-10 working days
Payment Terms:T/T, Western Union
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Site Member
Location:
Shenzhen Guangdong China
Address:
Room 403 Block A,Huafeng SOHO Creative World Hangcheng Industrial Zone Qianjin 2nd Road,Xixiang Baoan Shenzhen,China
Supplier`s last login times:
within 27 hours
Product Details
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Product Details
RF Rogers Material ER 3.38 0.5 mm 0.5 OZ Pcb Assembly With Silkscreen Peeelable Mask For Wilreless Gateway
Products Details
| Raw Material | Rogers |
| Layer Count | 6 |
| Board Thickness | 0.5 mm |
| Copper Thickness | 0.5 oz |
| Surface Finish | Gold Nickel Finger Plating |
| Solder Mask | Blue |
| Silkscreen | White |
| Min. Trace Width/Spacing | 0.075/0.075mm |
| Min. Hole Size | 0.25mm |
| Hole Wall Copper Thickness | ≥20μm |
| Measurement | 560*400mm |
| Packaging | Inner: Vacuum-packed in soft plastic bales Outer: Cardboard Cartons with double straps |
| Application | Communication,automobile,cell,computer,medical |
| Advantage | Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
| Special Requirements | Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering And Gold Finger Are Acceptable |
| Certification | UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |
PCB Capability
| Layer | 1-30L |
| Material | CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material,Copper Clad Laminate ,Rogers ,Neclo, Taconic and Isola pcb . |
| Board Thinckness | 0.2-6mm |
| Max Finish Size | 800*508mm |
| Min. Drill Hole Size | 0.25mm |
| Min. Line Width | 0.075mm(3mil) |
| Min. Line Spacing | 0.075mm(3mil) |
| Surface finish | HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP |
| Copper thickness | 0.5-4.0 Oz |
| Solder mask color | green/black/white/red/blue/yellow |
| Inner packing | Vacuum packing, Plastic Bag |
| Outer packing | standard carton packing |
| Hole tolerance | PTH:±0.076,NTPH:±0.05 |
| Certificate | ISO9001,SGS |
| Profiling punching | Routing,V-CUT,Beveling |
Parameter:
Rogers 4003 C Pcb With 3.38 ER . There are 0.127 mm ,0.254 mm
,0.762 mm 0.508 mm 1.6 mm board thinckness with 1 oz , 2 oz ,3 oz .
Rogers 4350 B pcb With 3.5 ER . There are 0.127 mm ,0.254 mm ,0.762
mm 0.508 mm 1.6 mm board thinckness with 1 oz , 2 oz ,3 oz .
Rogers 5880 Pcb With 2.2 ER . There are 0.127 mm ,0.254 mm ,0.762
mm 0.508 mm 1.6 mm board thinckness with 1 oz,2 oz, 3 oz
Rogers 3003 Pcb With 3 ER . There are 0.127mm,0.508mm 0.762mm 1.6 mm 3 mm Board Thinckness with 1 oz ,2 oz , 3 oz .
Rogers 3010 Pcb With 10.2 ER . There are 0.635 mm Thinckness Board with 1 oz , 2 oz ,3 oz .
PrePreg Material
| Parameter | Value |
| Specific gravity/density | 1.850 g/cm3 (3,118 lb/cu yd) |
| Water absorption | −0.125 in < 0.10% |
| Temperature index | 140 °C (284 °F) |
| Thermal conductivity, through-plane | 0.29 W/(m·K), 0.343 W/(m·K) |
| Thermal conductivity, in-plane | 0.81 W/(m·K), 1.059 W/(m·K) |
| Rockwell hardness | 110 M scale |
| Bond strength | > 1,000 kg (2,200 lb) |
| Flexural strength (A; 0.125 in) - LW | > 440 MPa (64,000 psi) |
| Flexural strength (A; 0.125 in) - CW | > 345 MPa (50,000 psi) |
| Tensile strength (0.125 in) LW | > 310 MPa (45,000 psi) |
| Izod impact strength - LW | > 54 J/m (10 ft·lb/in) |
| Izod impact strength - CW | > 44 J/m (8 ft·lb/in) |
| Compressive strength - flatwise | > 415 MPa (60,200 psi) |
| Dielectric breakdown (A) | > 50 kV |
| Dielectric breakdown (D48/50) | > 50 kV |
| Dielectric strength | 20 MV/m |
| Relative permittivity (A) | 4.8 |
| Relative permittivity (D24/23) | 4.8 |
| Dissipation factor (A) | 0.017 |
| Dissipation factor (D24/23) | 0.018 |
| Dielectric constant permittivity | 4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz |
| Glass transition temperature | Can vary, but is over 120 °C |
| Young's modulus - LW | 3.5×106 psi (24 GPa) |
| Young's modulus - CW | 3.0×106 psi (21 GPa) |
| Coefficient of thermal expansion - x-axis | 1.4×10−5 K−1 |
| Coefficient of thermal expansion - y-axis | 1.2×10−5 K−1 |
| Coefficient of thermal expansion - z-axis | 7.0×10−5 K−1 |
| Poisson's ratio - LW | 0.136 |
| Poisson's ratio - CW | 0.118 |
| LW sound speed | 3602 m/s |
| SW sound speed | 3369 m/s |
| LW Acoustic impedance | 6.64 MRayl |
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.
RF Rogers Material ER 3.38 0.5 mm 0.5 OZ Pcb Assembly With Silkscreen Peeelable Mask For Wilreless Gateway
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