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5.8G Induction PCB High Frequency Board 1.6MM Radio Board Linear
transponder
Specification:
High frequency pcb high-performance insulating material for
microwave, radio frequency (RF) and high-speed digital signal
processing (DSP) market with PTFE/type woven glass fiber fabric
sheet.This material can be applied to LNAs LNBs, PCS/PCN antenna
system, global positioning system (GPS) and UMTS antenna system,And
the power amplifier, passive components, collision avoidance radar
system, aviation help guide remote control technology and system of
the phased array radar.
High frequency materials are UL 94V-0 rated for active devices and
high power RF designs.
Specification:
Brand: XCE |
Model: XCEH |
Board size: 9*19cm |
Cu thickness: 35UM |
Material: High Frequency Material |
Min line space&width: 4Mil |
Advantage
5.8G Induction PCB High Frequency Board 1.6MM Radio Board Linear
transponder
1.Sufficient high frequency material raw
2. PCB Have the comprehensive quality control system
3. PCB good price
4. PCB quick turn delivery time from 48hours.
5. PCB certification(ISO/UL E354810/RoHS)
6. 12 years experience in exporting service
7. PCB is no MOQ/MOV.
8. PCB is high quality.Strict through theAOI(Automated Optical
Inspection),QA/QC,fly porbe ,Etesting
Parameter
XCE PCB technical specifications | |
Material | High Frequency PCB |
Layer No. | 2 |
Min board thickness | 2 layer0.2mm |
Max panel size | 508*610mm |
Board thickness tolerance | T≥0.8mm±8%.,T<0.8mm±5% |
Wall hole copper thickness | >0.025mm(1mil) |
Finished hole | 0.2mm-6.3mm |
Min line width | 4mil/4mil(0.1/0.1mm) |
Min bonding pad space | 0.1mm(4mil) |
PTH aperture tolerance | ±0.075mm(3mil) |
NPTH aperture tolerance | ±0.05mm(2mil) |
Hole site deviation | ±0.05mm(2mil) |
Profile tolerance | ±0.10mm(4mil) |
Board bend&warp | ≤0.7% |
Insulation resistance | >1012Ωnormal |
Through-hole resistance | <300Ωnormal |
Electric strength | >1.3kv/mm |
Current breakdown | 10A |
Peel strength | 1.4N/mm |
Soldmask regidity | >6H |
Thermal stress | 288℃20Sec |
Testing voltage | 50-300V |
Min buried blind via | 0.2mm(8mil) |
Outer copper thickness | 1oz-5oz |
Inner cooper thickness | 1/2 oz-4oz |
Aspect ratio | 8:1 |
SMT min green oil width | 0.08mm |
Min green oil open window | 0.05mm |
Insulation layer thickless | 0.075mm-5mm |
Taphole aperture | 0.2mm-0.6mm |
Special technology | Indepedance,Blind buried via,thick gold,aluminum PCB |
Surface finish | HASL,Lead free HASL,Immersion Gold, Immersion Tin, |
Description :
RO4350B materials are proprietary woven glass reinforced
hydrocarbon/ceramics with electrical performance close to
PTFE/woven glass and the manufacturability of epoxy/ glass.
Providing tight control on dielectric constant and low loss while
utilizing the same processing method as standard epoxy/glass,
RO4350B is available at a fraction of the cost of conventional
microwave laminates. No special through-hole treatments or handling
procedures are required as with PTFE based microwave materials.
RO4350B materials are UL 94V-0 rated for active devices and high
power RF designs.
Description :
RT/duroid 5880 high frequency laminates are PTFE composites
reinforced with glass microfibers.The randomly oriented microfibers
result in exceptional dielectric constant uniformity.
The dielectric constant of these high frequency laminates is the
lowest of all products, and low dielectric loss make them well
suited for high frequency/ broad band applications where dispersion
and losses need to be minimized. Because of its extremely low water
absorption characteristics, RT/duroid 5880 laminates are ideal for
applications in high moisture environments.
RT/duroid 5880 laminates are easily cut, sheared and machined to
shape, and resistant to all solvents and reagents normally used in
etching printed circuits or plating edges and holes. RT/duroid 5870
and 5880 laminates have the lowest electrical loss of any
reinforced PTFE material, low moisture absorption, are isotropic,
and have uniform electrical properties over frequency.
Description :
RT/duroid 6002 microwave materials are a low dielectric constant
laminate offering electrical and mechanical properties essential in
designing complex microwave structures which are mechanically
reliable and electrically stable.
The thermal coefficient of dielectric constant is extremely low
from -55oC to+150oC (-67°F to 302°F) which provides the designers
of filters, oscillators and delay lines the electrical stability
needed in demanding applications.
Description :
RT/duroid 6006 microwave laminates are ceramic-PTFE composites
designed for electronic and microwave circuit applications
requiring a high dielectric constant. RT/duroid 6006 laminate is
available with a dielectric constant value of 6.15 and RT/duroid
6010LM laminate has a dielectric constant of 10.2.
RT/duroid 6006 microwave laminates feature ease of fabrication and
stability in use. They have tight dielectric constant and thickness
control, low moisture absorption, and good thermal mechanical
stability.
RO3200 series material RO3203 (r = 3.02) and RO3210 (r = 10.2) two
composition, suitable for application RO3000 series material but
need better mechanical strength of the occasion. RO3200 series
material is a combination of PTFE / ceramic with PTFE / woven
fiberglass laminated, with good rigidity and RO3000 materials, the
material in this series can also be produced with mixed FR4
multilayer MLB
Description :
RO3003 high frequency circuit materials are ceramic-filled PTFE
composites intended for use in commercial microwave and RF
applications. This family of products was designed to offer
exceptional electrical and mechanical stability at competitive
prices.
RO3003 excellent stability of dielectric constant over temperature
including the elimination of the step change in dielectric
constant, which occurs near room temperature with PTFE glass
materials. Additionally, RO3003 laminates exhibit a low dissipation
factor of 0.0013 at 10 GhZ.