Multilayer PCB SMT DIP Electronic PCBA SMT Service 1.6MM Electronic Board

Brand Name:XCE
Certification:CE,ROHS, FCC,ISO9008,SGS,UL
Model Number:XCEM
Minimum Order Quantity:1pcs
Delivery Time:5-10 days
Payment Terms:T/T,Western union
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Site Member
Location: Shenzhen Guangdong China
Address: Room 403 Block A,Huafeng SOHO Creative World Hangcheng Industrial Zone Qianjin 2nd Road,Xixiang Baoan Shenzhen,China
Supplier`s last login times: within 27 hours
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Product Details

Multilayer PCB SMT DIP Electronic PCBA SMT Service 1.6MM Electronic Board

Quick detail:

Origin:ChinaSpecial: PCB Assembly
Layer:2Thickness:1.6mm
Surface: HASL-LFHole:0.8



Specification:
We also have ability for PCB layout ,PCBA and Circuit assembly, specializes in producing the various electronic products based on your customized designs and do pcba,pcb assembly for all kinds of small ,medium Volume electronic products
Enabling you to focus on product development and sales, we can solve your production technology issues and take care of product quality
The operation we can handle for you is from the Bare pc board fabrication, full component procurement, SMT/BGA/DIP assembly, mechanical/case assembly, rubber molding, functional testing, repair, inspection of finished goods to shipment arrangement

Product Description
Supply OEM Electronic circuit board assembly with high quality
Material : FR4 94v0 tg-130
Layers (GERBER FILE) : 2 layers
Board Thickness : 1.6mm
Copper Thickness : 2oz
Surface Treatment :HASL-LF
Solder Mask : green
Silk Screen : white
Data File Format : gerber file andbill of material BOM
Board size: 200*105mm
Min. Hole Size : 0.15mm
Hole Size Tolerance : +/-0.05mm (2 mil)
Profile and V-Cut : v cut
Special Process : Embedded Capacity



Typical Applications
SMD package, Chip-on-board and Flip Chip assembly technique
0201 chip, Micro BGA, u-BGA, QFN and LGA assembly
AI and Thru-hole assembly
RoHS, REACH compliance and Lead-Free solder technology
Chip Programming
Conformal Coating
ICT test and AOI inspection
ESD Protection Control Procedure
IPC-A-610E Class II and Class III Workmanship Standard

PCB Assembly Details:
Standard Component Sourcing Service
Supplier →Components Purchase →IQC →Protection Control →Material Supply →Firmware
Technical Requirement for PCB Assembly:
v Professional Surface-mounting and Through-hole soldering Technology
v Various sizes like 1206,0805,0603,0402,0201 components SMT technology
v ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
v PCB Assembly With UL,CE,FCC,Rohs Approval
v Nitrogen gas reflow soldering technology for SMT.
v High Standard SMT&Solder Assembly Line
v High density interconnected board placement technology capacity.
PCB Assembly Manufacturing Procedures:
vProgram Management
PCB Files →DCC →Program Organizing →Optimization →Checking
vSMT Management
PCB Loader →Screen Printer →Checking →SMD Placement →Checking →Air Reflow →Vision Inspection →AOI →Keeping
vPCBA Management
THT→Soldering Wave (Manual Welding) →Vision Inspection →ICT →Flash →FCT →Checking →Package →Shipment

Parameter:

oItemData
1Layer:1 to 24 layers
2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3Board thickness:0.20mm to 3.4mm
4Copper thickness:0.5 OZ to 4 OZ
5Copper thickness in hole:>25.0 um (>1mil)
6Max. Board Size:(580mm×1200mm)
7Min. Drilled Hole Size:4mil(0.1mm)
8Min. Line Width:3mil (0.075mm)
9Min. Line Spacing:3mil (0.075mm)
10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11Solder Mask Color:Green/Yellow/Black/White/Red/Blue
12Shape tolerance:±0.13
13Hole tolerance:PTH: ±0.076 NPTH: ±0.05
14Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15Certificate:UL,SGS,ISO 9001:2008
16Special requirements:Buried and blind vias+controlled impedance +BGA
17Profiling:Punching, Routing, V-CUT, Beveling

PCB Assembly Capability

QuantityPrototype&Low Volume PCB Assembly,from 1 Board to 250,is specialty,or up to 1000
Type of AssemblySMT,Thru-hole, DIP
Solder TypeWater Soluble Solder Paste,Leaded and Lead-Free
ComponentsPassive Down to 0201 size
BGA and VFBGA
Leadless Chip Carriers/CSP
Double-sided SMT Assembly
Fine Pitch to 0.8mils
BGA Repair and Reball
Part Removal and Replacement
Bare Board SizeSmallest:0.25*0.25 inches
Largest:20*20 inches
File FormateBill of Materials
Gerber files
Pick-N-Place file
Types of ServiceTurn-key,partial turn-key or consignment
Component packagingCut Tape,Tube,Reels,Loose Parts
Turn TimeSame day service to 15 days service
TestingFlying Probe Test,X-ray Inspection AOI Test



Our PCB assembly capability and services: SMT / THT / DIP.
1. Component Purchasing Service
2. SMT assembly and Through hole components insertion
3. IC pre-programming / Burning on-line
4. Function testing as requested
5. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc)
6. Packing design










Product Tags:
China Multilayer PCB SMT DIP Electronic PCBA SMT Service 1.6MM Electronic Board supplier

Multilayer PCB SMT DIP Electronic PCBA SMT Service 1.6MM Electronic Board

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