High Speed Multilayer High Frequency PCB HDI Board Fabrication With Impedance Control

Brand Name:XCE
Certification:CE,ROHS, FCC,ISO9008
Model Number:XCEP
Minimum Order Quantity:1pc
Place of Origin:China
Price:negotiation
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Location: Shenzhen Guangdong China
Address: Room 403 Block A,Huafeng SOHO Creative World Hangcheng Industrial Zone Qianjin 2nd Road,Xixiang Baoan Shenzhen,China
Supplier`s last login times: within 27 hours
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Product Details

HDI pcb, quick turn HDI pcb, blind microvia pcb&laser Microvia filling pcb mfg. Professional PCB FAB. No MOQ. One-stop PCBA. China PCB company. Services: Metal Core PCB Service, Rigid Flex PCB Service, Heavy copper PCB Service, Flexible Circuit Service etc.


HDI PCB Fr4 High Speed Multilayer Fabrication With Impedance Control


Specification

PCB Type:FR4 PCB
Layer :4 layer
Min .Line Width/Space:8milmil/8mil
Min. Via Diameter:0.3mm
Finish Thickness:20mil
Surface Finish:ENIG
Size:3*6MM
Material:KB FR4
Color:green
Application:aviation



High frequency PCB Introduce:

ModelParameterthickness(mm)Permittivity(ER)
F4BF4B0.382.2
F4B0.552.23
F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
F4Bk0.8,1.52.65
F4B0.83.5
FE=F4BM12.2
RogersRO58800.254 0.508 0.7622.20 ± 0.02
RO43500.254 0.508,0.8,1.5243.5
RO40030.5083.38
TACONICTLF-350.83.5
TLA-60.254,0.8,1,1.5,2.65
TLX-80.254,0.8,1,1.62.55
RF-60A0.646.15
TLY-50.254,0.508,0.82.2
TLC-320.8,1.5,33.2
TLA-350.83.2
ARLONAD255C06099C1.52.55
MCG0300CG0.83.7
AD0300C0.83
AD255C03099C0.82.55
AD255C04099C12.55
DLC22012.2



Parameter

Profile tolerance±0.10mm(4mil)
Board bend&warp≤0.7%
Insulation resistance>1012Ωnormal
Through-hole resistance<300Ωnormal
Electric strength>1.3kv/mm
Current breakdown10A
Peel strength1.4N/mm
Soldmask regidity>6H
Thermal stress288℃20Sec
Testing voltage50-300v
Min buried blind via0.2mm(8mil)
Outer cooper thickness1oz-5oz
Inner cooper thickness1/2 oz-4oz
Aspect ratio8:1
SMT min green oil width0.08mm
Min green oil open window0.05mm
Insulation layer thickness0.075mm-5mm
Aperture0.2mm-0.6mm
Special technologyInpedance,blind buried via,thick gold,aluminumPCB
Surface finishHASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating



Description:

FR4 Multi-Layer PCB refer to printed circuit board has more than two copper layers, such as 4L, 6L, 8L, 10L, 12L, etc. As technology improving, people can put more and more copper layers on the same board. Currently, we can produce 20L-32L FR4 PCB.
By this structure, engineer can put trace on different layers for different purpose, such as layers for power, for signal transfering, for EMI shielding, for components assembly, and so on. In order to avoid too many layers, Buried Via or Blind via will be designed in multi-layer PCB. For board more than 8 layers, high Tg FR4 material will be popular than normal Tg FR4.
More layers it is, more complex & difficult the manufacturing will be, and more expensive the cost will be. The lead time of multi-layer PCB is different from normal one, please contact us for accurate leading time.

China High Speed Multilayer High Frequency PCB HDI Board Fabrication With Impedance Control supplier

High Speed Multilayer High Frequency PCB HDI Board Fabrication With Impedance Control

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