300*300mm PCB UV Laser Depaneling Machine,Laser Singulation PCB Depanelers

Brand Name:SMTfly
Certification:CE
Model Number:CWVC-6
Minimum Order Quantity:1Set
Delivery Time:30 Working days after payment
Place of Origin:China
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Location: Shenzhen Chongqing China
Address: Building 2, Gang Hua Xing Industrial Park, Chongqing Road, Fuyong Town, Shenzhen, China
Supplier`s last login times: within 1 hours
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300*300mm PCB UV Laser Depaneling Machine,Laser Singulation PCB Depanelers Features:


More quick and easy, shorten the delivery time;

High quality ,no distortion,surface clean& uniformity;

Gathering the CNC tech,laser tech,software tech…High accuracy,High speed;


PCB Laser Cutting Application


FPC and some relative materials;

FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting.


Advantages of Laser PCB Depaneling/Singulation


No mechanical stress on substrates or circuits;

No tooling cost or consumables;

Versatility – ability to change applications by simply changing settings;

Fiducial Recognition – more precise and clean cut;

Optical Recognition before PCB depaneling/singulation process begins;

Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc);

Extraordinary cut quality holding tolerances as small as < 50 microns;

No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards.


PCB UV Laser Depaneling Machine,Laser Singulation PCB Depanelers Parameters:


Parameter
Technical ParameterMain body of laser1000*940*1520
Weight450KG
PowerAC220V
LaserOptoware 10/12/15/17W
Material≤1.2mm
Precision±20μm
Platform±2μm
Working Area300*300mm
Maximum3KW
VibratingCTI(US)
Laser Wavelength355nm
Diameter20±5μm
Ambient20±2℃
Ambient< 60%
The MachineMarble

PCB Depaneling Equipment Laser Depaneling of Flex PCB-FPC Cutting Machine​ Description:


PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.

Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.



More information welcome to contact us:


Email/Skype: s5@smtfly.com

Mobile/Wechat/WhatsApp: +86-136-8490-4990

China 300*300mm PCB UV Laser Depaneling Machine,Laser Singulation PCB Depanelers supplier

300*300mm PCB UV Laser Depaneling Machine,Laser Singulation PCB Depanelers

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