Semi-automatic room temperature bonding machine 2/4/6/8/12inch Compatible material Sapphire Si SiC InP GaAs GaN LT/LN Diamond Glass
Brand Name:ZMSH
Certification:rohs
Model Number:Semi-automatic room temperature bonding machine
Minimum Order Quantity:2
Delivery Time:5-10months
Payment Terms:T/T
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Location:
Shanghai Shanghai China
Address:
Room.1-1805,No.1079 Dianshanhu Road,Qingpu Area Shanghai city, China /201799
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within 13 hours
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Abstract of Semi-automatic room temperature bonding machine
Semi-automatic room temperature bonding machine 2/4/6/8/12inch Compatible material Sapphire Si SiC InP GaAs GaN LT/LN Diamond Glass
Semi-Automatic Room Temperature Bonding Machine is a precision
device for Wafer-Level or Chip-Level bonding. Mechanical pressure +
surface activation technology enables permanent bonding between
materials at room temperature (20-30 ° C) without high temperatures
or additional adhesives. It is suitable for semiconductor
packaging, MEMS manufacturing, 3D IC integration and other fields,
especially for the bonding needs of heat-sensitive materials and
micro and nano structures.
Characteristic of Semi-automatic room temperature bonding machine
(1) Bonding technology
- Normal temperature bonding: operating temperature 25±5℃, avoid
thermal stress damage to sensitive devices (such as CMOS, flexible
substrate).
- Surface activation treatment: Plasma or chemical activation is
optional to improve the bond strength (>10MPa).
- Multi-material compatibility: Support direct bonding of silicon
(Si), Glass (Glass), quartz, polymer (PI/PDMS) and other materials.
(2) Precision and control
- Alignment accuracy: ±0.5μm (visual alignment system + precision
mechanical platform).
- Pressure control: 0-5000N adjustable, resolution ±1N, uniformity
>95%.
- Real-time monitoring: Integrated force sensor + optical
interferometer, real-time feedback bond quality.
(3) Automation function
- Semi-automatic operation: manual loading and unloading +
automatic bonding process, supporting single chip or wafer level
processing.
- Programmable formulation: Store multiple sets of process
parameters (pressure, time, activation conditions).
- Safety protection: emergency braking + anti-collision design, in
line with SEMI S2/S8 safety standards.
(4) Cleanliness and reliability
- Class 100 Clean environment: built-in HEPA filter, particle
control <0.3μm.
- Low defect rate: bond interface cavity rate <0.1% (@200mm
wafer).
Technical specifications
The semi-automatic room temperature bonding machine solves the
limitation of traditional bonding technology on heat-sensitive
materials through high precision and low temperature process, and
has irreplaceable advantages in the fields of 3D IC, MEMS and
optoelectronics. We are committed to providing customers with high
reliability, low cost bonding solutions to facilitate the
development of advanced packaging and micro and nano manufacturing
technology.
| Wafer size: | ≤12inch, downward compatible with irregular shape samples |
| Adaptive materials: | Si, LT/LN, sapphire, InP, Sic, GaAs, GaN, diamond, glass, etc |
| Feeding mode: | Manual feeding |
| Pressure system maximum pressure: | 80 kN |
| Surface treatment: | In-situ activation and sputtering deposition |
| Sputtering target: | ≥3, rotatable |
| Bond strength: | ≥2.0J/ ㎡@room temperature |
Application of Semi-automatic room temperature bonding machine
(1) Semiconductor advanced packaging
· 3D IC integration: Through silicon (TSV) wafers are bonded at
room temperature to avoid warping problems caused by high
temperatures.
· Heterogeneous integration: Stacking bonding of logic chips and
memory chips (such as HBM).
(2) MEMS device manufacturing
· Wafer-level packaging: vacuum sealing bonding of MEMS devices
such as accelerometers and gyroscopes.
· Microfluidic chip: PDMS and glass bond at room temperature to
maintain biological activity.
(3) Optoelectronics and display
· LED package: Sapphire substrate (Sapphire) and silicon substrate
bonding without glue.
· AR/VR optical module: low temperature bonding of waveguide and
glass lens.
(4) Scientific research and special applications
· Flexible electronics: lossless bonding of PI substrate to thin
film sensor.
· Quantum devices: low-temperature compatible bonding of
superconducting qubit chips.
ZMSH service
ZMSH provides full process support services for semi-automatic room
temperature bonding machines, including:
Process development: Provide bonding parameter optimization and
surface activation solutions for different materials (Si/Glass/PI,
etc.);
Equipment customization: Optional high-precision alignment module
(±0.2μm), vacuum bonding chamber or nitrogen environment control;
Technical training: on-site operation guidance + process debugging
training to ensure efficient use of equipment;
After-sales guarantee: 12-month whole machine warranty, key
components (pressure sensor, optical system) 24 hours quick
replacement;
Remote support: Real-time fault diagnosis and software upgrades to
reduce downtime.
Q&A
1. Q: What is a semi-automatic room temperature bonding machine
used for?
A: It bonds wafers or chips at room temperature without adhesives,
ideal for heat-sensitive materials in 3D IC and MEMS packaging.
2. Q: How does room temperature wafer bonding work?
A: It uses surface activation (like plasma) and precise pressure to
create permanent bonds without thermal stress.
Tag: #Semi-automatic room temperature bonding machine,
#2/4/6/8/12inch, #Compatible material Sapphire, #Si, #SiC, #InP,
#GaAs, #GaN, #LT/LN, #Diamond, #Glass
Semi-automatic room temperature bonding machine 2/4/6/8/12inch Compatible material Sapphire Si SiC InP GaAs GaN LT/LN Diamond Glass
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