Analysing Inline SPC Electronics X Ray Machine LX2000 FPC For BGA QFN Soldering

Brand Name:UNICOMP
Certification:CE, FDA
Model Number:LX2000
Minimum Order Quantity:1Set
Delivery Time:30 days
Payment Terms:T/T, L/C
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Verified Supplier
Location: Shenzhen Guangdong China
Address: Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen
Supplier`s last login times: within 1 hours
Product Details Company Profile
Product Details

Fully automatic Inspection and Analysing Inline AXI LX2000 X-ray for BGA , QFN soldering void inspection one FPC


Technical Parameters and Specifications

System Summary
Footprint2595(W)×1392(D)×1992(H)mm
Machine Weight1900 kg (X-Ray) / 700kg (Conveyor)
Power SupplyAC 110~220V, 50/60Hz
Plywood Packing Size180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor)
Packing Weight2000kg (X-Ray) / 800kg (Conveyor)
Power Consumption3.5 kW
X-Ray Tube
Tube TypeSealed
Max. Power8W
Voltage0~90kV (Adjustable)
Focus Spot Size5μm
Imaging System
DetectorFlat Panel Detector (FPD)
Pixel Size85μm
Effective Detection Area130*130mm
Frame Rates20fps
Pixel Matrix1536*1536
System Magnification200X
Software
Auto-measuringAuto Inspection and Analysing for Ok & NG Components
CNC ModeCNC Programmable Inspection, Easy Operation and User Friendly
ReworkSupport Rework Database Management System
Data ConnectionSupport MES/ERP/SPC System
NavigationConvenient Target Point Positioning System
Motion Control System
Movement ControlJoystick, Keypad, Mouse & Touch Panel (PLC)
Adjustable Tunnel width80~350mm
Max. Inspection Sample400*350mm / 10kg
Min . Inspection Sample100*80mm
ManipulatorAuto Inline System
Industrial PC
Monitor22’’ FHD LCD Display
System OSWindows 10 64bit
Hard disk1TB
RAM8GB
CPU modelIntel i7 Processor
Other Features
Energy SavingX-Ray Auto-off when it's out of work over than 5 minutes
Safety OperationElectromagnetic Interlock, Warning Light
Authority ManagementPassword Magnagement
X-Ray Safety<1μSv/h (Meets All International Standards)
* Specifications are subject to change without notice, All trademarks are the property of the system maker.

Application

Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small
Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc.


Functions and Features



inspection images


China Analysing Inline SPC Electronics X Ray Machine LX2000 FPC For BGA QFN Soldering supplier

Analysing Inline SPC Electronics X Ray Machine LX2000 FPC For BGA QFN Soldering

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