PCBA Unicomp X Ray Machine AX7900 High Resolution FPD For BGA Die Bond Wire Inspection

Brand Name:UNICOMP
Certification:CE, FDA
Model Number:AX7900
Minimum Order Quantity:1Set
Delivery Time:30 days
Payment Terms:T/T, L/C
Contact Now

Add to Cart

Verified Supplier
Location: Shenzhen Guangdong China
Address: Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen
Supplier`s last login times: within 1 hours
Product Details Company Profile
Product Details

PCBA X-Ray machine Unicomp AX7900 with high resolution FPD for BGA void IC die bond wire inspection


Description of IC Xray machine AX7900:

90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm x 420mm , max. detection area 380 x 380mm, with ~300X System Magnification.


FEATURES of IC Xray machine AX7900:

  1. 90KV 5μm X-ray tube, FPD Detector.
  2. Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option).
  3. Motion controls include: X/Y table motion plus Z axis tube and detector movement, ±60° tilt motion (option).
  4. Multi-function DXI image processing system.
  5. X/Y programming function for multiple image inspection routines
  6. Max. loading area 420mm x 420mm, max. detection area 380 x 380mm, with ~300X System Magnification.
  7. BGA void/area auto-measurement plus report generation.

APPLICATION of IC Xray machine AX7900:

  1. LED, SMT, BGA, CSP, Flip Chip Inspection.
  2. Semiconductor, Packaging components, Battery Industry.
  3. Electronic components, Auto parts, Photovoltaic Industry.
  4. Aluminum Die Casting, Moulding Plastic.
  5. Ceramics, Other Special Industries

Technical Specifications

ItemDefinitionSpecs
System ParametersSize1100(L)x1100(W)x1500(H)mm
Weight1000kg
Power220AC/50Hz
Power Consumption0.8kW
X-ray TubeTypeClosed
Max.Voltage80kV/90kV
Max.Power12W/8W
Spot Size5μm/15μm
X-ray SystemIntensifierFPD
Monitor22 ‘’LCD
System Magnification160 X/360X
Detection RegionMax.Loading Size440mm x 400mm
Max.Inspection Area420mm x 380mm
X-ray Leakage<1μSv/h



Inspection Images of IC Xray machine AX7900:


China PCBA Unicomp X Ray Machine AX7900 High Resolution FPD For BGA Die Bond Wire Inspection supplier

PCBA Unicomp X Ray Machine AX7900 High Resolution FPD For BGA Die Bond Wire Inspection

Inquiry Cart 0