TG170 FR4 Multilayer Pcb Manufacturing Process Printed Wiring Board Assembly

PCB General Capability

Number of Layer

1 - 18 Layer

Maximum Processing Area

680 × 1000MM

Min Board Thickness

2 Layer - 0.3MM ( 12 mil )

4 Layer - 0.4MM ( 16 mil )

6 Layer - 0.8MM ( 32 mil )

8 Layer - 1.0MM ( 40 mil)

10 Layer - 1.1MM ( 44 mil )

12 Layer - 1.3MM ( 52 mil )

14 Layer - 1.5MM ( 59 mil )

16 Layer - 1.6MM ( 63 mil )

18 Layer - 1.8MM ( 71 mil )

Finished Board Thickness Tolerance

Thickness ≤ 1.0MM, Tolerance: ± 0.1MM

1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%

Twisting and Bending

≤ 0.75%, Min: 0.5%

Range of TG

130 - 215 ℃

Impedance Tolerance

± 10%, Min: ± 5%

Hi-Pot Test

Max: 4000V/10MA/60S

Surface Treatment

HASL, With Lead, HASL Free Lead

Flash Gold, Immersion Gold

Immersion Silver, Immersion Tin

Gold Finger, OSP

PCB Cu Thickness + Plating

Out Layer Cu Thickness

1 - 6OZ

Inner Layer Cu Thickness

0.5 - 4OZ

Cu Thickness of PTH

20UM ≤ Average ≤ 25UM

Min: 18UM

HASL with Lead

Tin 63% Lead 37%

HASL Free Lead

7UM ≤ Surface Thickness ≤ 12UM

Thick Gold Plating

Ni Thickness: 3 - 5UM ( 120u" - 200u" )

Gold Thickness: 0.025 - 1.27UM ( 1u" - 50u" )

Immersion Gold

Ni Thckness: 3 - 5UM ( 120u" - 200u" )

Gold Thickness: 0.025 - 0.15UM ( 1u" - 3u" )

Immersion Silver

Ag Thickness: 0.15- 0.75 UM ( 6u" - 30u" )

Gold Finger

Ni Thickness: 3 - 5UM ( 120u" - 160u" )

Gold Thickness: 0.025 - 1.51UM ( 1u" - 60u" )

U940 PCB Pattern Limit Capability

Min Width

0.075MM ( 3 mil )

Min Trace

0.075MM ( 3 mil )

Min Width of Ring ( Inner Layer )

0.15MM ( 6 mil )

Min Width of Ring ( Out Layer )

0.1MM ( 4 mil )

Min Solder Bridge

0.1MM ( 4 mil )

Min Height of Legend

0.7MM ( 28 mil )

Min Width of Legend

0.15MM ( 6 mil )

PCB Holes Processing Capability

Final Hole Size

Min: Laser 0.1MM, Machine 0.2MM

Drilling Hole Size

0.10 - 6.5MM

Drilling Tolerance

NPTH: ±0.05MM, PTH: ±0.075MM

Final Hole Size Tolerance ( PTH )

φ0.20 - 1.60MM ± 0.075MM

φ1.60 - 6.30MM ± 0.10MM

Final Hole Size Tolerance ( NPTH )

φ0.20 - 1.60MM ± 0.05MM

φ1.60 - 6.50MM ± 0.05MM

Drilling Strip Hole

-0L ~tu.'gth /width 2:1

Min Strip Hole Width 0.65MM

Length & Width Tolerance ± 0.05MM

Board Thickness / Hole Size

≤ 10:1

PCB Cover Thickness Capability

Solder Mask Color

Green,Matte Green,Yellow,Blue,Red,Black,Matte Black,White

Solder Mask Thickness

Surface Line ≥ 10UM

Surface Line Corner ≥ 6UM

Surface Board 10 - 25UM

Solder Mask Bridge Width

Legend Color

White,Yellow,Black

Min Height of Legend

0.70MM ( 28 mil )

Min Width of Legend

0.15MM ( 6 mil )

Blue Gel Thickness

0.2 - 1.5MM

Blue Gel Tolerance

±0.15MM

Carbon Print Thickness

5 - 25UM

Carbon Print Min Space

0.25MM

Carbon Print Impedance

200Ω

Blind/Burried/Half Via PCB Capability

Parameters

(1+1)e.g.

(4-layer)blind via:1-2,2-4

(6-layer)buried via:2-3,3-4

(8-layer)blind/buried:1-3,4-5,6-8

Min Via

Laser 0.1MM, Machine 0.2MM

Half Via

Min: 0.6MM

Impedance Capability

Resistance Value

Single-ended 50 - 75Ω, Difference 100Ω, Coplanar 50 - 75Ω