3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates

Brand Name:JIMA
Certification:SGS, ISO,Reach, RoHS
Model Number:EDCU-HC
Minimum Order Quantity:100kg
Delivery Time:5-15 days
Payment Terms:T/T, L/C
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Verified Supplier
Location: Shanghai Shanghai China
Address: No.60 Guoxia Road, Yangpu District, Shanghai,China.
Supplier`s last login times: within 48 hours
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Product Details

3 / 4 OZ Rolled Copper Foil,Copper Foil Paper for IC Package Substrates


Specifications:

  • AvailableThickness: 12 micron-70micron
  • Available Width: 5-520 mm
  • Available Length: 500-5000 M
  • Coil ID: 76 mm,152 mm
  • Purity:99.8%

Mechanical features

  1. Various kinds of Thickness and Roughness.
  2. Low profile and good peel strength with resin.
  3. Good chemical resistance.

Application:

  • IC package substrates and HDI(High-density-interconnect) boards

Overview:

  • We propose two kinds of copper foils and new production method, aiming at improving productivity and yield in coreless board process.
  • 2,PCS or PCM (Peelable Copper Foil on Shiny side or Matte side)
  • PCS or PCM are peelable copper foil with peelable organic material coated on copper surface.

FAQ:

Q1: Can you supply the sample?

A1: We can supply samples to check the quality before bulk order. But the price will be sample price not wholesale price.


Q2. Do you test all your goods before delivery?
A2: Yes, we have 100% test before delivery.


Q3. what is your standard width?

A3: 520mm and 620mm,we accept customization for the width. we can cut it into any size that you demand after pass discussing.


Typical properties of High coarse copper foil

ClassificationUnitRequirementTest Method
Foil Designation/HM1IPC-4562A
Nominal thickness/1/2 OZ3/4 OZ1OZIPC-4562A
Area Weightg/㎡150±5228±8285±10

IPC-TM-650

2.2.12.2

Purity≥99.8

IPC-TM-650

2.3.15

Foil ProfileShiny side (Ra)սm≤0.4≤0.4≤0.4

IPC-TM-650

2.3.17

Matte side(Rz)um≤8≤10≤12
Tensile Strength

R.T.(23℃)


Mpa≥220≥235≥280

IPC-TM-650

2.3.18

Elongation

R.T.(23℃)


≥2≥3≥3

IPC-TM-650

2.3.18

Peel Strength(FR-4)CEM-1N/mm≥1.5≥1.7≥2.0

IPC-TM-650

2.4.8

PTC≥0.5≥0.6≥0.8
Pinholes&porosityNumberNo

IPC-TM-650

2.1.2

Anti-oxidizationR.T.(23℃)day180 or customize/
H.T.(200℃)Minutes60 or customize/

We test the peel strength with CEM-1/PTC ,please reconfirm with your pp.


China 3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates supplier

3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates

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