0.01mm Thick Hvlp Copper Foil , High Temperature Resistant ED Copper Board For Pcb
Brand Name:JIMA
Certification:SGS, ISO,Reach, RoHS
Model Number:EDCU-HC
Minimum Order Quantity:100kg
Delivery Time:5-15 days
Payment Terms:T/T, L/C
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Location:
Shanghai Shanghai China
Address:
No.60 Guoxia Road, Yangpu District, Shanghai,China.
Supplier`s last login times:
within 48 hours
Product Details
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Product Details
High temperature resistance Width 1380mm thickness 0.01mm VLP ED copper foil for PWB
Quickly Introduction.
1) Matte side treatment in back or red.
2) T: 25µm, W:5-1380 mm,standard width:1290mm.
3) internal diameter: 3inch or 6 inch, Length: 500-5000 M.
Products Performance.
a.The perfect physical characteristics of the fine and uniform crystal structure.
B.The very low profile, the high intensity, and high elongation.
c.The high peel strength, no copper powder movement, the clear figure.
VLP ED copper foils application:
1. Communications CCL.
2. Military and other high-power circuit boards.
3. high-frequency board.
RFQ:
Q1. How to save after the box opened?
Keep the dry environment,and is better use it in 30days.
Q2.what is the Internal diameter?
76/152/ custom.
Q3: Can you supply the sample?
We can supply samples to check the quality before bulk order. But the price will be sample price not wholesale price.
Packaging:
Typical properties of VLP-S-B/R copper foil for FPC or inner layer of HDI.
Classification | Unit | Requirement | Test Method | ||||||||
| Foil Designation | / | 1 | H | M | 1 | IPC-4562A | |||||
| Nominal thickness | / | 10um | 12um | 1/2 OZ (18um) | 3/4 OZ(25um) | 1 OZ(35um) | IPC-4562A | ||||
| Area Weight | g/㎡ | 98±4 | 107±4 | 153±5 | 228±8 | 285±10 | IPC-TM-650 2.2.12.2 | ||||
| Purity | ％ | ≥99.8 | IPC-TM-650 2.3.15 | ||||||||
| Foil Profile | Shiny side(Ra) | սm | ≤2.5 | ≤2.5 | ≤2.5 | ≤2.5 | ≤2.5 | IPC-TM-650 2.3.17 | |||
| Matte side(Rz) | um | ≤2.5 | ≤2.5 | ≤2.5 | ≤2.5 | ≤2.5 | |||||
| Tensile Strength | R.T.(23℃) | Mpa | ≥300 | ≥300 | ≥300 | ≥300 | ≥300 | IPC-TM-650 2.3.18 | |||
| H.T.(180℃) | Mpa | ≥200 | ≥200 | ≥200 | ≥200 | ≥200 | |||||
| Elongation | R.T.(23℃) | ％ | ≥4 | ≥5 | ≥6 | ≥8 | ≥10 | IPC-TM-650 2.3.18 | |||
| H.T.(180℃) | ％ | ≥5 | ≥6 | ≥7 | ≥8 | ≥8 | |||||
| Peel Strength(FR-4) | N/mm | ≥0.8 | IPC-TM-650 2.4.8 | ||||||||
| Ibs/in | ≥4.6 | ||||||||||
| Pinholes&porosity | Number | No | IPC-TM-650 2.1.2 | ||||||||
| Anti-oxidization | R.T.(23℃) | 180days | / | ||||||||
| H.T.(200℃) | 60 Minutes | / | |||||||||
Remark:Standard Width 1295mm,max width 1370(±1)mm,May according to the customer request tailor.We test the peel strength with PI ,please reconfirm with your pp.
0.01mm Thick Hvlp Copper Foil , High Temperature Resistant ED Copper Board For Pcb
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