35μm High-frequency Microwave Forward Copper Foil For High Frequency PCB
Brand Name:JIMA
Certification:SGS, ISO,Reach, RoHS
Model Number:EDCU
Minimum Order Quantity:10kg
Delivery Time:5-15 days
Payment Terms:T/T, L/C
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Location:
Shanghai Shanghai China
Address:
No.60 Guoxia Road, Yangpu District, Shanghai,China.
Supplier`s last login times:
within 48 hours
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Product Details
35μm High-frequency microwave forward copper foil for High Frequency PCB
JIMA Copper is doing copper foil of Li-ion battery 4.5um to 14um more than 12 years. and production capacity 150000tons /years.
With a thickness of 35 μm, JIMAcopper is the ideal choice after careful development and repeated verification. In high-frequency PCB
applications, this precise thickness ensures that the copper foil has the best electrical properties.
Features:
1,Special silane treatment with high peel strength 2,Nanoscale treatment of copper nodules 3,Excellent anti-oxidation and shelf life 4,Excellent electrical performance (low dielectric constant, low
dielectric loss, high insulation resistance) 5,outstanding surface quality, stable mechanical properties (high
strength, good flexibility, good dimensional stability) 6,reliable thermal performance (high heat resistance, good heat
dissipation) 7,special structural design (positive rotation structure,
ultra-thin thickness)
Application:
1,(HDI) High Density Interconect
2,HSD (High Speed Digital)
3,Base Station / Server
4,Communication field (satellite communication, 5G communication, radar system)
5,aerospace field (avionics, satellite antenna)
6,medical field (medical equipment, medical imaging)
7,scientific research field (high-frequency electronics laboratory, microwave communication research)
Details Package: wooden box
FAQ:
Q1: delivery time ? A: The general delivery time is 10~15 working days. Q2: What's your minimum order quantity? A: The MOQ is 10kg. Q3. what is your standard width? A: 300mm-1300mm we accept customization for the width. we can cut it into any size that
you demand after pass discussing.
35μm High-frequency microwave forward copper foil standard sample digital:
Specifications ( 3 5 μ m ) | ||
Mechanical Properties | Ra on matte side Rz | 4-9 μm customizable |
Tensile strength | >330 MPa | |
Elongation | >5% | |
Peel Strength(PTFE) | ≥1.6 N/mm(PTFE) | |
35μm High frequency microwave inversion copper foilstandard sample digital:
Specifications (35 μm) | ||
Mechanical Properties | Ra on matte side Rz | 2.8-3.0μm customizable |
Tensile strength | >330 MPa | |
Elongation | >5% | |
Peel Strength(PTFE) | ≥1.6 N/mm(PTFE) | |
35μm High-frequency microwave forward copper foil Technical Data Sheet:
Specification | Details | |
Thickness | 35μm | |
Width | ≤620mm | |
Item | Unit | Parameter |
Grade | - | High-frequency microwave grade (custom specification) |
Copper content | % | ≥99.95 (typical for high-quality copper foils) |
Area Weight | g/㎡ | [Calculated value based on thickness and density] |
Double-sided(Ra) | um | ≤0.1 (smooth surface for enhanced signal transmission) |
State Normal (tensile strength) | Mpa | ≥450 (high strength for stability and durability) |
State Normal (elongation) | % | ≥2.0 (sufficient flexibility for processing) |
Conductivity | 20℃ IACS | ≥98% (excellent electrical conductivity) |
High temperature oxidation resistance(180℃ 1 hour) | - | Qualified (resistant to oxidation at elevated temperatures) |
Remark: accept customization, Standard Width,300-1300(±1)mm,
35μm High-frequency Microwave Forward Copper Foil For High Frequency PCB
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