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Industry HDI controller Remote control Printed Circuit Board .pcba baord
1. Features
1. One Stop OEM Service, Made in Shenzhen of China
2. Manufactured by Gerber File and BOM List from Customer
3. FR4 Material, Meet 94V0 standard
4. SMT, DIP technology suport
5. Lead Free HASL, Environmental Protection
6. UL, CE, ROHS Compliant
7. Shipping By DHL,UPS, TNT, EMS or Customer requirement
2. PCB Technical capability
SMT | Position accuracy:20 um |
Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP | |
Max. component height::25mm | |
Max. PCB size:680×500mm | |
Min. PCB size:no limited | |
PCB thickness:0.3 to 6mm | |
PCB weight:3KG | |
Wave-Solder | Max. PCB width:450mm |
Min. PCB width: no limited | |
Component height:Top 120mm/Bot 15mm | |
Sweat-Solder | Metal type :part, whole, inlay, sidestep |
Metal material:Copper , Aluminum | |
Surface Finish:plating Au, plating sliver , plating Sn | |
Air bladder rate:less than20% | |
Press-fit | Press range:0-50KN |
Max. PCB size:800X600mm | |
Testing | ICT,Probe flying,burn-in,function test,temperature cycling |
Certifications:
ISO9001 / ISO14001 / ISO45001 (Military) / TS16949 (Automotive) / RoHS / UL
HDI printed circuit boards, also known as microvia or μvia PCBs, are an advanced PCB technology that enable high-density interconnections and miniaturized electronic components.
Key features and functions of HDI printed circuit boards include:
Miniaturization and increased density:
HDI PCBs feature smaller, more closely spaced vias and vias, allowing for
higher interconnect density.
This makes it possible to design more compact, space-saving
electronic devices and components.
Microvias and Stacked Vias:
HDI PCBs use microvias, which are smaller, laser-drilled holes that are
used to connect different layers of the PCB.
Stacked vias, where multiple vias are stacked vertically, can
further increase interconnect density.
Multi-layer structure:
HDI PCBs can have a higher layer count than traditional PCBs, typically 4
to 10 or more.
The increased number of layers allows for more complex routing and
more connections between components.
Advanced materials and processes:
HDI PCBs often use specialized materials such as thin copper foil,
high-performance laminates, and advanced plating techniques.
These materials and processes enable the creation of smaller, more
reliable, higher-performance interconnects.
Improved electrical properties:
The reduced trace widths, shorter signal paths, and tighter
tolerances of HDI PCBs help improve electrical performance, including improved signal
integrity, reduced crosstalk, and faster data transmission.
Reliability & Manufacturability:
HDI PCBs are designed for high reliability, with features like improved
thermal management and enhanced mechanical stability.
Manufacturing processes for HDI PCBs, such as laser drilling and advanced plating techniques, require
specialized equipment and expertise.
HDI printed circuit board applications include:
Smartphones, Tablets, and Other Mobile Devices
Wearable Electronics and IoT (Internet of Things) Devices
Automotive electronics and advanced driver assistance systems (ADAS)
High speed computing and telecommunications equipment
Military and aerospace electronic equipment
Medical devices and instruments
The continued demand for miniaturization, enhanced functionality, and higher performance in a variety of electronic products and systems has driven the adoption of HDI PCB technology.
2. PCB Pictures