10 layers FR4 ENIG PCB Circuit Board Manufacturing with golden finger

Brand Name:KAZ Circuit
Certification:ISO9001, TS16949, UL, RoHS
Model Number:PCB-B-041931
Minimum Order Quantity:1 pc
Delivery Time:2~3 weeks
Payment Terms:T/T, Western Union, Paypal
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Verified Supplier
Location: Shenzhen Guangdong China
Address: Room 502, 26# Building, Funing Hi-Tech Industrial Park, Fuhai Street, Bao'an, Shenzhen, Guangdong, China, 518103
Supplier`s last login times: within 1 hours
Product Details Company Profile
Product Details

10 layers FR4 ENIG PCB Circuit Board Manufacturing with golden finger​


Detail Specifications:


Layers10
MaterialFR-4
Board Thickness1.6mm
Copper Thickness1oz
Surface TreatmentHASL
Soldmask & SilkscreenGreen & White
Quality StandardIPC Class 2, 100% E-testing
CertificatesTS16949, ISO9001, UL, RoHS



What KAZ Circuit can do for you:


  • PCB & PCBA Design
  • PCB manufacturing (prototype, small to medium, mass production)
  • Components Sourcing
  • PCB Assembly/SMT/DIP


To get a full quotation of the PCB/PCBA, pls provide the information as below:


  • Gerber File, with detail specification of the PCB
  • BOM List (Better with excel fomart)
  • Photoes of the PCBA (If you have done this PCBA before)


Company Informaiton:


KAZ Circuit is a professional PCB manufacturer from China since 2007, also provide PCB Assembly service for our customers. Now with about 300 employees. Certified with ISO9001,TS16949, UL, RoHS. We are confident to provide you quality products with factory-directed price within the fastest delivery time!



Manufacturer Capacity:

CapacityDouble Sided: 12000 sq.m / month
Multilayers: 8000sq.m / month
Min Line Width/Gap4/4 mil (1mil=0.0254mm)
Board Thickness0.3~4.0mm
Layers1~20 layers
MaterialFR-4, Aluminum, PI
Copper Thickness0.5~4oz
Material TgTg140~Tg170
Max PCB Size600*1200mm
Min Hole Size0.2mm (+/- 0.025)
Surface TreatmentHASL, ENIG, OSP

SMT Capacity


Multilayer PCB


Multilayer PCB is a printed circuit board made of more than two layers of copper foil. It consists of an inner copper foil, an insulating substrate and an outer copper foil, and the interconnection between the layers is achieved by drilling and copper plating. Compared with single-layer or double-layer PCBs, multilayer PCBs can achieve higher wiring density and complex circuit design.


Advantages of multi-layer PCBs:

Higher wiring density and complex circuit design capabilities
Better electromagnetic compatibility and signal integrity
Shorter signal transmission paths, improved circuit performance
Higher reliability and mechanical strength
More flexible power and ground distribution


Composition of multi-layer PCBs:

Inner copper foil: Provides conductive layer and wiring
Insulating substrate (FR-4, high-frequency low-loss dielectric, etc.): Isolates and supports each copper foil layer
Outer copper foil: Provides surface wiring and interface
Perforated metallization: Realizes electrical connection between layers
Surface treatment: HASL, ENIG, OSP and other surface treatment processes


Design and manufacture of multi-layer PCBs:

Circuit design: Signal integrity, power/ground integrity design of multi-layer boards
Layout and wiring: Reasonable layer allocation and routing optimization
Process design: Aperture size, layer spacing, copper foil thickness, etc.
Manufacturing process: Lamination, drilling, copper plating, etching, surface treatment, etc.


More photoes of this 10 layers FR-4 ENIG High Tg PCB Circuit Board Manufacturing with golden finger

China 10 layers FR4 ENIG PCB Circuit Board Manufacturing with golden finger supplier

10 layers FR4 ENIG PCB Circuit Board Manufacturing with golden finger

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