Mix Material Rigid Printed Circuit Boards Multilayer PCB Fabrication

Brand Name:KAZ
Certification:ISO9001, TS16949, UL, RoHS
Model Number:KAZ-B-1032651
Minimum Order Quantity:1 pc
Delivery Time:10~15 working days
Payment Terms:T/T, Paypal, Western Union
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Verified Supplier
Location: Shenzhen Guangdong China
Address: Room 502, 26# Building, Funing Hi-Tech Industrial Park, Fuhai Street, Bao'an, Shenzhen, Guangdong, China, 518103
Supplier`s last login times: within 1 hours
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Product Details

More details for the Mix Material Rigid Printed Circuit Boards Multilayer PCB Fabrication


Specificaiton:


Layers4
MaterialFR-4 + Rogers
Board Thickness0.98mm
Copper Thickness1oz
Surface TreatmentHASL
Soldmask & SilkscreenGreen & White
Quality StandardIPC Class 2, 100% E-testing
CertificatesTS16949, ISO9001, UL, RoHS

Our service are as following:

1. Offer service for PCB and PCBA design
2. Offer service for purchasing components according to your PCBA boom list
3. Producing PCB according to your gerber file
4. Offer SMT service for your PCBA
5. No limit quantity
6. Supplying of small volume production
7. Quick turn is available


  • Product performance
  • Prompt delivery
  • Quality approvals
  • Reputation
  • Service
  • Small orders accepted
  • Brand-name parts
  • Country of origin
  • Distributorships offered
  • Electronic link
  • Experienced staff
  • Form A
  • Green product
  • Guarantee/warranty
  • Product features
  • International approvals
  • Military specifications
  • Packing

What KAZ Circuit can do for you:

  • PCB manufacturing (prototype, small to medium, mass production)
  • Components Sourcing
  • PCB Assembly/SMT/DIP


To get a full quotation of the PCB/PCBA, pls provide the information as below:

  • Gerber File, with detail specification of the PCB
  • BOM List (Better with excel fomart)
  • Photoes of the PCBA (If you have done this PCBA before)

Multilayer PCB
Multilayer PCB is a printed circuit board made of more than two layers of copper foil. It consists of an inner copper foil, an insulating substrate and an outer copper foil, and the interconnection between the layers is achieved by drilling and copper plating. Compared with single-layer or double-layer PCBs, multilayer PCBs can achieve higher wiring density and complex circuit design.


Advantages of multi-layer PCBs:

Higher wiring density and complex circuit design capabilities
Better electromagnetic compatibility and signal integrity
Shorter signal transmission paths, improved circuit performance
Higher reliability and mechanical strength
More flexible power and ground distribution


Composition of multi-layer PCBs:

Inner copper foil: Provides conductive layer and wiring
Insulating substrate (FR-4, high-frequency low-loss dielectric, etc.): Isolates and supports each copper foil layer
Outer copper foil: Provides surface wiring and interface
Perforated metallization: Realizes electrical connection between layers
Surface treatment: HASL, ENIG, OSP and other surface treatment processes


Design and manufacture of multi-layer PCBs:

Circuit design: Signal integrity, power/ground integrity design of multi-layer boards
Layout and wiring: Reasonable layer allocation and routing optimization
Process design: Aperture size, layer spacing, copper foil thickness, etc.
Manufacturing process: Lamination, drilling, copper plating, etching, surface treatment, etc.


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Mix Material Rigid Printed Circuit Boards Multilayer PCB Fabrication

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