Multilayer PCB Circuit Board 4 Layers FR-4 Tg150 1.0mm ENIG 1U" PCB Assembly Service Multilayer PCB Board

Brand Name:KAZ
Certification:ISO9001, UL, RoHS
Model Number:PCB-B-369424
Minimum Order Quantity:1
Delivery Time:9~10
Place of Origin:China
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Location: Shenzhen Guangdong China
Address: Room 502, 26# Building, Funing Hi-Tech Industrial Park, Fuhai Street, Bao'an, Shenzhen, Guangdong, China, 518103
Supplier`s last login times: within 1 hours
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Product Details

Multilayer PCB Circuit Board 4 Layers FR-4 Tg150 1.0mm ENIG 1U" PCB Assembly Service


This is a 4 layers FR-4 Tg150 1.0mm 1/H/H/1 oz copper ENIG 1u" multilayer PCB circuit board, detail specification as below, with IPC Class 2 quality standard, panel size is 112.5*202mm .

  • 4 layers
  • FR-4 Tg150
  • ENIG 1u"
  • 1.0mm board thickness
  • 1/H/H/1 oz.
  • Green soldmask
  • White silkscreen
  • IPC Class 2

Manufacturing Capacity - Rigid PCB


ItemProduction Capacity
Type of ProductsSingle Sided, double sided & multilayer
Max Board SizeSingle & Double Sided: 600*1500mm
Multilayer: 600*1,200 mm
Surface FinishHASL, ENIG, OSP, Immersion Silver, Golden Finger, etc.
Layers1~20
Boad Thickness0.4~4.0mm
Base Copper18um(1/2oz), 35um (1oz), 70um (2oz), 105um (3oz), 150um (4oz), 300um (8oz)
Board MaterialFR-4, Aluminum base, Polymide, copper base, ceramic base
Min Drilling Hole Size0.1mm
Min Line Width & Space0.075mm
Platting GoldNickle Plating Thickness 2.5~5um, gold thickness 0.05~0.1um
Tin SprayingTin thickness 2.5~5um
Milling Spacewire & edge: 0.15mm, hole & edge: 0.2mm, Contour Tolerance: +/-0.1mm
Socket ChamferAngle: 30°/45°/60° Depth: 1~3mm
V-CutAngle: 30°/45°/60° Depth: 1/3 of board thickness, min aise: 80*80mm
On-Off TestMax Testing Area: 400*1,200mm
Max Testing Point: 12,000 points
Max Testing Voltage: 300V
Max Insulation Resistance: 100mΩ
Impedance Control Tolerance± 10%
Soldering Endurance85℃~105℃ / 280℃~360℃

PCB size: 112.5*202mm / 25 UP

IPC Class 2 quality standard.


What KAZ Circuit can do for you:

  • PCB manufacturing (prototype, small to medium, mass production)
  • Components Sourcing
  • PCB Assembly/SMT/DIP


To get a full quotation of the PCB/PCBA, pls provide the information as below:

  • Gerber File, with detail specification of the PCB
  • BOM List (Better with excel fomart)
  • Photoes of the PCBA (If you have done this PCBA before)


Company Informaiton:


KAZ Circuit is a professional PCB manufacturer from China since 2007, also provide PCB Assembly service for our customers. Now with about 300 employees. Certified with ISO9001,TS16949, UL, RoHS. We are confident to provide you quality products with factory-directed price within the fastest delivery time!



Manufacturer Capacity:


CapacityDouble Sided: 12000 sq.m / month
Multilayers: 8000sq.m / month
Min Line Width/Gap4/4 mil (1mil=0.0254mm)
Board Thickness0.3~4.0mm
Layers1~20 layers
MaterialFR-4, Aluminum, PI
Copper Thickness0.5~4oz
Material TgTg140~Tg170
Max PCB Size600*1200mm
Min Hole Size0.2mm (+/- 0.025)
Surface TreatmentHASL, ENIG, OSP

Multilayer PCB

Multilayer PCB is a printed circuit board made of more than two layers of copper foil. It consists of an inner copper foil, an insulating substrate and an outer copper foil, and the interconnection between the layers is achieved by drilling and copper plating. Compared with single-layer or double-layer PCBs, multilayer PCBs can achieve higher wiring density and complex circuit design.


Advantages of multi-layer PCBs:

Higher wiring density and complex circuit design capabilities

Better electromagnetic compatibility and signal integrity

Shorter signal transmission paths, improved circuit performance

Higher reliability and mechanical strength

More flexible power and ground distribution


Composition of multi-layer PCBs:

Inner copper foil: Provides conductive layer and wiring

Insulating substrate (FR-4, high-frequency low-loss dielectric, etc.): Isolates and supports each copper foil layer

Outer copper foil: Provides surface wiring and interface

Perforated metallization: Realizes electrical connection between layers

Surface treatment: HASL, ENIG, OSP and other surface treatment processes


Design and manufacture of multi-layer PCBs:

Circuit design: Signal integrity, power/ground integrity design of multi-layer boards

Layout and wiring: Reasonable layer allocation and routing optimization

Process design: Aperture size, layer spacing, copper foil thickness, etc.

Manufacturing process: Lamination, drilling, copper plating, etching, surface treatment, etc.


More photoes for this 4 layers FR-4 Tg150 1.0mm 1/H/H/1 oz copper ENIG 1u" multilayer PCB


KAZ Company information

Manufacturing Equipments - Rigid PCB



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China Multilayer PCB Circuit Board 4 Layers FR-4 Tg150 1.0mm ENIG 1U  PCB Assembly Service Multilayer PCB Board supplier

Multilayer PCB Circuit Board 4 Layers FR-4 Tg150 1.0mm ENIG 1U" PCB Assembly Service Multilayer PCB Board

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