Thermal Fatigue Resistant SMT Machine Parts / Tin Lead Free Solder Bar
Model Number:SMT spare parts Tin Lead Free Solder Welding Dim Bar
Minimum Order Quantity:1
Delivery Time:8days
Payment Terms:T/T
Place of Origin:shenzhen
Price:negotiation
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Location:
Shenzhen Guangdong China
Address:
Fuda shajing street, Baoan district, Shenzhen, China
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SMT spare parts Tin Lead Free Solder Welding Dim Bar Sn/AG/Cu Sn/Cu Sn/AG
Our company provides Tin Lead Free Solder Bar with a variety of alloy composition , content and size of the diameter of pharmaceutical different specifications tin for customer choice:
| Alloy composition (wt.%) | Diameter | Flux Content | Weight / Roll | Melting pointºC | Working point | Usage & Application | |||
| Type | Tin-Sn | Silver-Ag | Copper-Cu | ||||||
| SAC305 | 96.50% | 3.00% | 0.50% | 0.8-3.0mm | 1.8-2.4% | 750-1000g | 217-219 | 280-320 | LED, IT, PCB, High-class electronics, Lighting industry, Radiators, Household appliance and Precise Instruments, Audio and Sound System and other soldering |
| SAC300 | 97.00% | 3.00% | 0% | 217-220 | 280-320 | ||||
| SAC0307 | 99.00% | 0.30% | 0.70% | 217-225 | 260-320 | ||||
| SAC07 | 99.30% | 0.00% | 0.70% | 227 | 260-280 | ||||
- Anti-oxidation tin lead free bar
- High temperature tin lead free bar
- Low temperature tin lead free bar
- Dim tin lead free bar
- Silver tin lead free bar
- Tin lead free solder bar for other particular applications
- 3.15cm * 1.5cm * 1.0cm
500g/PC- Eutectic alloy.
- Bridge-free and icicle-free soldering.
- Smooth, bright, well-formed fillets, free of gross micro-cracks, irrespective of the cooling rate.
- Good through-hole penetration.
- Good topside fillet formation.
- Dross rate equal or lower than tin-lead solder.
- Does not require a nitrogen atmosphere.
- Does not erode copper from holes, pads and tracks.
- Low rate of copper leaching makes it easy to control the copper content of the solder bath.
- Lower aggressiveness to stainless steel and other solder pot materials as compared to tin-silver-copper alloys.
- Thermal fatigue resistance and creep strength better than tin-lead.
- Slow, even growth of the intermetallic layer at the solder/substrate interface.
- Also performs well in selective and dip soldering.
Thermal Fatigue Resistant SMT Machine Parts / Tin Lead Free Solder Bar
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