Name: Halogen Free PCB Printing Service 12 Layer Carbon Oil FR4 TG 140 Type PCB Board
Brand: China chao sheng
Price: 1 USD

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Halogen Free PCB Printing Service 12 Layer Carbon Oil FR4 TG 140 Type PCB Board

Brand Name:China chao sheng

Certification:ISO/UL/RoHS/TS

Model Number:CSPCB1518

Minimum Order Quantity:1PCS

Delivery Time:15-18day

Payment Terms:T/T, Western Union

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Shenzhen Chaosheng Electronic Technology Co.,Ltd

Active Member

Location: Hong kong Hong kong China

Address: Huishang Building, 19-128 Nathan Road, Yau Tsim Sha Tsui, Yau Tsim, Hong Kong

Supplier`s last login times: within 48 hours

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Product Details Company Profile

Product Details

12layer carbon oil + FR4 TG 140, type PCB, multilayer pcb board PCB Requirements

Learn PCB Service Requirements on the PCB The PCB assembly PCB DFM Requirements

Printed circuit board (pcb) and PCBA product areas
Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
Winding circuit board (fpc) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

Detailed Product Description

Product Areas:	Medical Bluetooth Module Motherboard	Minimum Line Width And Space:	3/3mil
Material:	Halogen-free FR-4 TG150	Minimum Hole:	0.10mm
Aspect Ratio:	10:1	Product Structure:	10 Layers AnylayerHDI
Impedance Value:	± 10%	Surface Treatment:	Immersion Gold, Electro-nickel Gold, Immersion Tin, OSP, Lead-free Spray Tin
Provide PCB Information:	Gberber, Production Requirements, MOQ Quantity	PCBA Information:	BOM Report, X, Y Left Plot
E-Test:	100% Electrical Test Prior Shipment

10 layers AnylayerHDI, Halogen-free FR-4 TG150 Thick copper + thick gold inner and outer copper, HDI Printed Circuit Boards, prototype pcb fabrication

1: Medical Bluetooth module motherboard
2: Halogen-free FR-4 TG150, inner and outer copper thickness 35um, minimum line width line spacing 3/4mil, hole ratio 10:1, minimum hole 0.10mm, blind hole buried hole, immersion gold, red solder resist, white
3: The board thickness is 1.60mm,
4: blind hole, resin plug hole + plating hole
Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB
Standard.
Quantities range from prototype to volume production.
100% E-Test

FAQ:

Q: What files do you use in PCB fabrication?

A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

Q: Is it possible you could offer sample?

A: Yes, we can custom you sample to test before mass production

Q: When will I get the quotation after sent Gerber, BOM and test procedure?

A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

Q: How can I make sure the quality of my PCB?

A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

PCB, FPC process production capability

Technical ltem		MassProduct	Advanced Technology
		2016	2017	2018
Max.Layer Count		26L	36L	80L
Through-hole plate		2～45L	2～60L	2～80L
Max.PCBSize(in)		24*52"	25*62"	25*78.75"
The layer number of FPC		1～36L	1～50L	1～60L
Max.PCBSize(in)		9.8"*196"	9.8"*196"	10"*196"Reel to reel
Layeredplatelayer		2～12L	2～18L	2～26L
Max.PCBSize(in)		9"*48"	9"*52"	9"*62"
Combination of hard and soft layers		3～26L	3～30L	3～50L
Interconnect HDI		5+X+5Interconnect HDI	7+X+7Interconnect HDI	8+X+8,Interconnect HDI
HDI PCB		4～45L	4～60L	4～80L
Interconnect HDI		3+20+3	4+X+4Interconnect HDI	4+X+4,Interconnect HDI
Max.PCBSize(in)		24"*43"	24"*49"	25"*52"
Material		FR-4 Rogers	FR-4 Rogers	FR-4 Rogers
Base material		Halogenfree,LowDK	Halogenfree,LowDK	Halogenfree,LowDK
Build-up Material		FR-4	FR-4	FR-4
BOard,Thickness(mm)	Min.12L(mm)	0.43	0.42～8.0mm	0.38～10.0mm
	Min.16L(mm)	0.53	1.60～8.0mm	0.45～10.0mm
	Min.18L(mm)	0.63	2.0～8.0	0.51～10.0mm
	Min.52L(mm)	0.8	2.50～8.0mm	0.65～10.0mm
	MAX(mm)	3.5	10.0mm	10.0mm
Min.CoreThickness um(mil)		254"(10.0)	254"(10.0)	0.10～254(10.0mm)
Min.Build up Dielectric		38(1.5)	32(1.3)	25(1.0)
BaseCopperWeight	Inner Layer	4/1-8 OZ	4/1-15 OZ	4/1-0.30mm
	Out Layer	4/1-10 OZ	4/1-15 OZ	4/1-30 OZ
Gold thick		1～40u"	1～60u"	1～120u"
Nithick		76～127u"	76～200u"	1～250u"
Min.HOle/Land um(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)

Min.Laser via/landum(mil)		60/170(2.4/6.8)	50/150(2/6)	50/150(2/6)

Min. IVH,Hole size/landum(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)

DieletricThickness		38(1.5)	32(1.3)	32(1.3)
		125(5)	125(5)	125(5)
SKipvia		Yes	Yes	Yes

viaoNhie(laserviaon BuriedPTH)		Yes	Yes	Yes

Laser Hole Filling		Yes	Yes	Yes

Technicalltem			Mass Product	Advanced Technolgy
			2017year	2018year	2019year
Drill hole depth ratio		ThroughHole	2017year	.40:1	.40:1
Aspet Ratio		Micro Via	.35:1	1.2:1	1.2:1
Copper Filling Dimple Size um(Mil)			10(0.4)	10(0.4)	10(0.4)
Min.LineWidth＆space		lnner Layer um(mil)	45/45(1.8/1.8)	38/38(1.5/1.5)	38/38(1.5/1.5)
		Plated Layer um(mil)	45/45(1.8/1.8)	38/38(1.5/1.5)	38/38(1.5/1.5)
BGAPitch mm(Mil)			0.3	0.3	0.3
Min.PTH Hole ring um(mil)			75(3mil)	62.5(2.5mil)	62.5(2.5mil)
Line Width Control		∠2.5MIL	±0.50	±0.50	±0.50
		2.5Mil≤L/W∠4mil	±0.50	±0.50	±0.50
		≦3mil	±0.60	±0.60	±0.60
Laminated structure		Layer by layer	3+N+3	4+N+4	5+N+5
		Sequential Build-up	20L Any Layer	36L Any Layer	52L Any Layer
		Multi-layer overlay	N+N	N+N	N+N
			N+X+N	N+X+N	N+X+N
		sequential Lamination	2+(N+X+N)+2	2+(N+X+N)+2	2+(N+X+N)+2
		Soft and hard bonding	2+(N+X+N)+2	2+(N+X+N)+2	2+(N+X+N)+2
PTH filling process			PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole

Company Profile

Chaosheng Company specializes in producing any order of HDI, high frequency mixed pressure HDI, soft and hard combined HDI, multi-layer ceramic, special size, mixed copper base, metal cladding, high and low copper, buried, buried resistance, special process, special materials High-end (PCB, FPC) circuit boards; product design, product development, software development, PCBA and FPCBA (SMT, post-weld, plug-in), processing and integrated production plants.

Factory set up history :

1982 the Japanese factory was established;

Zhe Jiang Factory
Jiang Xi Factory 2006 Guangdong Shenzhen Division

2007 Dong Guan Factory

2010 Jiang Su, Si Chuan Factory

Chad Sheng’s business includes real estate, plastic, metals, LED, finance, high preision PCB equipment, chemicals, high precision PCB & FPC manufacture, More than 100 main customers are multi-national enterprise. Existing total factory area is more than 100,000 sqm. The capacities of PCB business are as below and the total turnover is over 30 billion RMB per year.

Double sided PCB 650,000 sqm/month

2L to 80L HDI with 1 to 4 layers

blind and buried PCB

& high layer-count PCB 160,000 sqm/month

Flexible Printed Ciccuit (FPC) 150,000 sqm/month

Chao Sheng can produce different kinds of PCBs such as :2-80 layers high layer count PCB

Flexible printed circuit, double-sided & multi-layer Aluminium PCB, ceramic PCB

1 to 4 layers blind & buried holes HDI PCB

Chao Sheng has Japan PCB & got the international certification such as UL, ISO9000, TS16949, ISO14000 AND QS8000. By use of modern technologies, IE, ERP and contemporary quality management systems and equipped with imported advanced precision equipments and production lines, Company’s objective “Global resources →Japan technology→create world class number one” can be achieved.

Our main customers are ABB, Omron, Seoul, Hua Wei, Ericsson, Toyota, Apple, Sony, Alco, BOE, Tongli, San Sheng, Samsung, LG, Fiber Home prod & after sales service, Emerson, etc. Many foreign and domestic famous enterprises build up their own brand name in the past years and have very good reputation. In order to fulfill customer’s step, Chao Sheng provides high end, middle end and low end products and services to customers. Our business philosophy - “better, faster and cost effective” are agreed by customers.

Company continues to concern environmental protection and clean production. We insist on continue developing strategy and stick on China and Global environmental convention. We have perfect environmental protection system and facilities which can treat waste, reduce waste and reduce energy. Company already achieved Guang Dong Province’s clean production requirement and exceed China (class 1) clean production requirement.

Base on our mission “To provide high quality PCB, on time and satisfactory services to the global electronic industry” and core system value “trust, mutual help, improvement, share customers are the core, markets are the trend” , Chao Sheng must achieve “to grow up to be first class PCB enterprise, and create value to customers, employees, society & share holers.”

Our goal is quality first, on time delivery, continuous improvement, customer satisfaction and provide first class services. We welcome all customers to visit our plants to give valuable comments, and hope to build up a long-term cooperation relationship.