MCGS Touch Screen Control BGA Rework Station Manual & Automatic Laser Position

Brand Name:HSTECH
Certification:CE
Model Number:HS-620
Minimum Order Quantity:1 set
Delivery Time:7~9 work days
Payment Terms:T/T, Western Union, MoneyGram
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Location: Shenzhen Guangdong China
Address: 3rd Floor,Building A,Sha Tang Bei Fang Yong Fa Industrial Area,Sha Jing, Bao an, Shenzhen, China
Supplier`s last login times: within 24 hours
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Product Details

MCGS Touch Screen Control Manual & Automatic Laser Position BGA Rework Station


Introduction


A BGA Rework Station is a specialized equipment used in the electronics manufacturing and repair industry to rework or replace Ball Grid Array (BGA) components on printed circuit boards (PCBs). BGA components are commonly used due to their high density and performance, but they can be challenging to repair when defects occur.


Features:

1.Automatic&Manual operation system.

2. 5 million CCD camera optical alignment system mount precision:±0.01mm.

3.MCGS touch screen control.

4.Laser position.

5.Repair success rate 99.99%.


​Specification:


BGA Rework StationModel:HS-620
Power SupplyAC 220V±10% 50/60Hz
Total power3500W
Heater powerUpper temp.zone 1200W,second temp.zone 1200W,IR temp.zone 2700W
Electric materialDriving motor+PLC smart temp.controller+color touch screen
Temperaturecontrol independent temp.controller,the precision can reach ±1℃
Temperature Interface1pcs
Locating wayV shape slot,PCB support jigs can adjust,laser light do fast centering and position
Overall dimensionL650mm*W630mm*H850mm
PCB sizeMax 450mm*390mm Min 10mm*10mm
BGA sizeMax 80mm*80mm Min 1mm*1mm
Weight of machine60KG
Usage Repairchips / phone motherboard etc

Applications


BGA Component Replacement:
Used to remove faulty BGA components and replace them with new ones, essential for repairs and upgrades.
Solder Joint Repair:
Facilitates the reflow of solder joints for reworking connections that may have failed or become cold soldered.
Prototyping:
Useful in prototyping environments where BGA components need to be frequently replaced or modified.
Quality Control:
Employed in quality control processes to inspect and repair PCBs before final assembly or shipment.


Benefits


Increased Reliability:
Enables effective repair of BGA components, extending the life of PCBs and reducing waste.
Cost-Effective Repairs:
Reduces the need for complete PCB replacements, saving costs in manufacturing and maintenance.
Enhanced Precision:
Provides precise temperature control and alignment for high-quality rework results.
Time Efficiency:
Streamlined rework processes allow for quicker turnaround times in manufacturing and repair environments.
Flexibility:
Can handle various sizes and types of BGA components, making them versatile for different applications.


China MCGS Touch Screen Control BGA Rework Station Manual & Automatic Laser Position supplier

MCGS Touch Screen Control BGA Rework Station Manual & Automatic Laser Position

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