Product Details
15''HD LCD monitor Mobile Phone BGA Rework Station with 5 Modes
Stepping Motor CCD Color
Introduction:
A Mobile Phone BGA Rework Station is a specialized piece of equipment designed for repairing and
reworking Ball Grid Array (BGA) components on mobile phone circuit
boards. These stations are crucial in the electronics repair
industry, especially for repairing smartphones and other portable
devices.
Features:
1. 5 work modes
2. 15''HD LCD monitor
3. 7''HD color touch screen
4. stepping motor
5. CCD color optical alignment system
6.Temperature accuracy within ±1℃
7.Mounting precision within ±0.01mm
8.Repair success rate: 99% +
9. Independent research and development of single-chip control
Specification:
Mobile Phone BGA Rework Station | Model:HS-700 |
Power Supply | AC 100V / 220V±10% 50/60Hz |
Total power | 2600W |
Heater power | Top heater 1200W(Max), bottom heater 1200W(Max) |
Electric material | Driving motor + smart temp. controller + color touch screen |
Temperature control | high precision K-sensor+ closed loop control + independent
temp.controller (the precision can reach ±1℃) |
Sensor | 1pcs |
Locating way | V shape PCB support + external universal fixture + laser light for
centering and positioning |
Overall dimension | L450mm*W470mm*H670mm |
PCB size | Max 140mm*160mm Min 5mm*5mm |
BGA size | Max 50mm*50mm Min 1mm*1mm |
Applicable PCB thickness | 0.3 - 5mm |
Mounting accuracy | ±0.01mm |
Weight of machine | 30KG |
Mount chip weight | 150g |
Working modes | Five: Semi-auto/Manual/Remove/Mount/Weld |
Usage Repair | chips / phone motherboard etc |
Applications
Mobile Phone Repair:
- Primarily used for repairing smartphones that have BGA components,
such as processors, memory chips, and graphics chips.
Consumer Electronics:
- Applicable in the repair of other consumer electronics that utilize
BGA technology, including tablets, laptops, and gaming consoles.
Prototyping and Development:
- Used in research and development environments for prototyping new
circuit designs that incorporate BGA packages.
Quality Control:
- Employed in quality assurance processes to rework defective
components before final assembly.
Advantages
Enhanced Repair Efficiency:
- Speeds up the rework process, allowing technicians to handle
multiple repairs quickly and efficiently.
Cost-Effective:
- Extends the life of devices by enabling the repair of expensive BGA
components rather than replacing the entire board.
Improved Precision:
- Advanced technology allows for high-precision repairs, reducing the
risk of damage to adjacent components.
Flexibility:
- Suitable for a wide range of BGA sizes and types, making it
versatile for different repair tasks.
User Training and Support:
- Many manufacturers provide training and support, helping
technicians to effectively use the equipment and improve their
repair skills.
Company Profile
Shenzhen HanSome Technology Co.,Ltd(HSTECH)was estabilished in 2012
by prefessional and experienced engineer who wroked many years in
EMS company,we specilized in PCB handling equipments at first, then
we develop the PCB depaneling machine and SMT cleaning machine.
HSTECH not only have professional technical team for R&D,but
also have a outgoing and experienced marketing team for research
and develop, grasps products developing directions, updates the
products and technics to meet the continue changing demands. In the
past years,we have been always keep innovating and exploing to make
cost-efficient products to help our customers saving cost and
labor, improving the production efficiency at the same time.
HSTECH set the goal for "High quality and Smart”, that based on the
concept of "Quality-Oriented and Customer-orented", and combined
the industry feature, smart technology persuit for the smart
factory.As for the after-sale service, we insist on
"responsibility", we will take reaction at the first when we got
quality feedbacks,and service our customers all the time.