Customizable Dispensing Valve for Diverse Applications 30CC PUR Injection Valve

30CC PUR Jetting Valve

Composition of PUR Injection Valve:

The PUR injection valve consists of multiple components: a drum heating module, a pressurized cap module, a nozzle heating module, a flow path module, a valve body module, and a heat dissipation module.

Function of Barrel Heating Module:

The barrel heating module supports the barrel and provides controlled, single-stage heating to initiate the gel warming process effectively.

Role of Pressurized Cap Module:

The pressurized cap module ensures the drum remains securely sealed and pressurized, managing the output pressure via a controller.

Efficiency of Heat Dissipation Module:

The heat dissipation module efficiently dissipates heat and minimizes noise emanating from the valve body.

Modular Design of Piezoelectric Injection Valve:

The piezoelectric injection valve employs a modular design. The gel-contacting part is known as the runner module, while the non-contacting part comprises the valve body module.

Customization of Flow Path Module:

The flow path module can be customized to cater to the dispensing needs of various applications.

Range of Nozzle Diameters:

Nozzle diameters are available within a range of 40µm to 500µm.

Types of Nozzles:

Nozzles are categorized into three types: flat jet, needle, and extension.

Cleaning of Runner Module and Nozzle:

Regular cleaning of runner modules should be done in an ultrasonic cleaner, with the caution not to immerse seals in organic solvents. Cleaning of nozzles requires the use of specific tools to prevent damage.

Nozzle and barrel heating

1. Prior to dispensing, the nozzle needs to be heated to a suitable temperature using a two-stage heating mode provided by the heating device.

2. By keeping the nozzle at a constant temperature, optimal gel performance is ensured, allowing the colloid to operate at its peak efficiency.

Specification

Advantages

Barrel Heating Compatibility:

The barrel heating system is compatible with a variety of hot melt adhesive volumes, including 30cc, 100cc, and 300cc.

Advantages of Modular Design:

The modularized design facilitates easy part replacement, straightforward debugging, and enables a wide range of process applications.

Spray Precision:

The spray volume can achieve an accuracy of 0.3nL, with a spray adhesive spot consistency accuracy as impressive as 98%.

Fine Line and Spot Capabilities:

The hot melt glue spraying process is capable of achieving a minimum line width of 0.17mm and a minimum spot diameter of 0.15mm.

Motion Platform Integration:

It can be seamlessly integrated with any motion platform currently available on the market.

Application Field

SMT/FPC/PCB,Assembly, flat panel display assembly, semiconductor packaging, LED industry, medical equipment industry,Non-marking lingerie industry.

Shenzhen HanSome Technology Co.,Ltd(HSTECH)was estabilished in 2012 by prefessional and experienced engineer who wroked many years in EMS company,we specilized in PCB handling equipments at first, then we develop the PCB depaneling machine and SMT cleaning machine. HSTECH not only have professional technical team for R&D,but also have a outgoing and experienced marketing team for research and develop, grasps products developing directions, updates the products and technics to meet the continue changing demands. In the past years,we have been always keep innovating and exploing to make cost-efficient products to help our customers saving cost and labor, improving the production efficiency at the same time.
HSTECH set the goal for "High quality and Smart”, that based on the concept of "Quality-Oriented and Customer-orented", and combined the industry feature, smart technology persuit for the smart factory.As for the after-sale service, we insist on "responsibility", we will take reaction at the first when we got quality feedbacks,and service our customers all the time.