White 1.2W/mK Two Compound Thermally Conductive Potting Compound for Electronic Component

Brand Name:Ziitek
Certification:RoHS
Model Number:TIS680-12AB
Minimum Order Quantity:5can
Delivery Time:3-7 work days
Payment Terms:T/T
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Location: Dongguan Guangdong China
Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, 523460 Guangdong Province, China
Supplier`s last login times: within 2 hours
Product Details Company Profile
Product Details

White 1.2W/mK Two Compound Thermally Conductive Potting Compound for Electronic Component


TIS™680-12AB Series is a two-part silicone potting adhesive with high thermal conductivity, room temperature curable,long working time and firere sistance.lt is especially suitable for capacitor, small electronic equipment sealing. Its flexible, elastic characteristics enable it to provide cushioning for the materials it is coated with. The lower viscosity aliows the thermal potting adhesive to cover the surface more fully,greatly increasing the efficiency of heat transfer from the heating device or the entire PCB to the metal case or diffusion plate,thus improving the efficiency and service life of the electronic.


TIS680-12AB-Series-TDS-REV04--High-Thermal-Conduct...


Features


> Good thermal conductive: 1.2W/mK
> Good insulation performance

> Good elasticity

> Lower shrinkage
> Low viscosity, easy gas emissions
> Good solvent resistance and waterproof performance
> longer working hours

> Excellent high and low temperature resistance
> No odor release during the curing process


Application


> Industrial control,transformer,coil, amplifier, high voltage package, relay, high current junction box, etc.;
> Heat sink assembly, thermal sensor potting, thermal conductive product potting;

> Heat conduction between the battery cell and the cold tube;

> LED and power drive potting;


Typical Properties of TIS™ 680-12AB Series
Material Properties (Before Curing)
 TISTM680-12ATISTM680-12B
ColorwhiteGray
Viscosity @25℃ Brookfield3000 mPa.s3000 cPs
Shelf life @25℃ in sealed container6 months6 months
 
Mixing ratio (weight ratio)A:B =100 :100
Mix colorGray
Operational Time
(250g @25℃)
30 mins
Conditions for Complete Curing@25℃ 24H
@70℃ 2H
@100℃ 1H
Material Properties(after Curing)
Hardness (Shore A)@25℃65
Density(g/cc)1.7
Operating temperature-40℃ ~160℃
Elongation120%
Elongation4.50%
CLTE(1/℃)3.0x 10^(-5)
Fire resistance UL94V-0
Water Absorption Rate (wt%)< 0.1
Thermal Conductivity1.2W/m-K
Thermal Impedance @1mm ( ℃- in²/W )0.48
Dielectric Breakdown Voltage ( V/mm)6000
Dielectric Constant@1MHz4.2
Volume resistivity @ 25℃( ohm-cm)3.0x 10^13

Packing details:

1KG A/B for each tank.

5KG A/B each.

10KG A/B each.


Company Profile


Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.



Why Choose us ?


1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract.

China White 1.2W/mK Two Compound Thermally Conductive Potting Compound for Electronic Component supplier

White 1.2W/mK Two Compound Thermally Conductive Potting Compound for Electronic Component

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