1.2W/MK One Component Dealcoholized Room Temperature Cured Thermally Conductive Silicone Adhesive
Brand Name:Ziitek
Certification:RoHS
Model Number:TIS580-12
Minimum Order Quantity:10kg
Delivery Time:3-8 work days
Payment Terms:T/T
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Location:
Dongguan Guangdong China
Address:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, 523460 Guangdong Province, China
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Product Details
Company Profile
Product Details
1.2W/MK One Component Dealcoholized Room Temperature Cured Thermally Conductive Silicone Adhesive
TIS™580-12 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective.
TIS™580-12 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use.
TIS™580-12 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.
TIS580-12 Series Datasheet-(E)-REV01.pdf
Feature
> Good thermal conductivity: 1.2W/mK
> Good maneuverability and good adhesion
> Low shrinkage
> Low viscosity, leads to void-free surface
> Good solvent resistance, water resistance
> Longer working life
> Excellent thermal shock resistance
Application
It mainly used in substituting thermally-conductive paste and pads,
which currently finds in gap-filling adhesives or heat conduction
between LED aluminium motherboard and heat sink, high power
electrical module and heat sink. Traditional methods such as fins
and screws fixing can be replaced by applying TIS580-12, resulting
a more reliable gap-filling thermal conduction, simplified handling
and more cost-effective. E.g. Massive application in integrated
circuits in portable computer, microprocessor, high power LED,
internal storage module, cache, integrated circuits, DC/AC
translator, IGBT and other power modules, encapsulation of
semi-conductors, relay switches, rectifiers and transfomers
Typical values of TISTM580-12 | ||
| Appearance | White paste | Test Method |
| Density(g/cm3,25℃) | 1.2 | ASTM D297 |
| Tack-free time(min,25℃) | ≤20 | ***** |
| Cure type(1-component) | Dealcoholized | ***** |
| Viscosity@25℃ Brookfield (Uncured) | 20K cps | ASTM D1084 |
| Total cure time(d, 25℃) | 3-7 | ***** |
| Elongation(%) | ≥150 | ASTM D412 |
| Hardness(Shore A) | 25 | ASTM D2240 |
| Lap Shear Strength(MPa) | ≥2.0 | ASTM D1876 |
| Peel Strength(N/mm) | ＞3.5 | ASTM D1876 |
| Operation temperature(℃) | -60～250 | ***** |
| Volume Resistivity(Ω·cm) | 2.0×1016 | ASTM D257 |
| Dielectric Strength(KV/mm) | 21 | ASTM D149 |
| Dielectric Constant (1.2MHz) | 2.9 | ASTM D150 |
| Thermal Conductivity W/(m·K) | 1.2 | ASTM D5470 |
| Flame Retardancy | UL94 V-0 | E331100 |
Package:
300ml/Tube, 24PCS/Box
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
1.2W/MK One Component Dealcoholized Room Temperature Cured Thermally Conductive Silicone Adhesive
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