High Temperature Waterproof Dull Black Solid Thermal Epoxy Glue for Electronic Components Potting

Brand Name:Ziitek
Certification:RoHS
Model Number:TIE280-12AB
Minimum Order Quantity:10kg
Delivery Time:3-8 work days
Payment Terms:T/T
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Location: Dongguan Guangdong China
Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, 523460 Guangdong Province, China
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Product Details Company Profile
Product Details

High Temperature Waterproof Dull Black Solid Thermal Epoxy Glue for Electronic Components Potting


Product Summary:


TIE™280-12AB is a two compound, high thermal conductive, low temperature cured, long pot life,fire resistant epoxy encapsulant compound. lt is design for potting of capacitors and electricaldevices.


TIE280-12AB-Series-Datasheet.pdf


Feature


> Good thermal conductive: 1.2W/mK
> Excellent insulation and smoothly sourface.

> Low shrinkage
> Low viscosity , expediting air releaseed.

> Excellent in solvents and water proof.

> Longer life time.
> Excellent thermal shock efficiecy andimpact resistance


Applications


> Automotive starters potting; General potting;

> Thermal detector potting
> Ferrite adhesion; TIP type LED; Good adhesion toaromatic polyester
> Relay sealant; Good adhesion to rubber, ceramics,PCB and plastics
> Power transformers and coils; Potting capacitors;Potting of small electrical devices
> Adhesion to metal glass and plastic;LCD & substrates adhesion; Coating and sealant;Coil ; IGBTS;Transformer; Fire retardant
> Optical / medical component adhesive


Typical Properties of TIE280-12AB Series
Typical Uncured Material
TIETM280-12A(Resin)Mixing ratio (weight ratio)
A:=1 :1
ColorBlack
Viscosity @25℃ Brookfield15000 cPsViscosity @25℃ Brookfield10000 cPs
Operating time (@25℃)45 mins
Shelf life @25℃ in sealed12 monthsspecific Gravity1.6 g/cc
Mixture ColorBlack
TIE280-12B(Hardener)Cure Schedule
ColorBlackCure at 25C3 hrs
Viscosity @25℃ Brookfield7000 cPs
Shelf life @25℃ in sealed container12 monthsCure at 7o°c30 mins
Cured Properties
Hardness @25℃85 Shore D
Operating temperature-40℃ ~160℃
Glass transition temperature Tg92℃
Rate of tension0.10%
Coefficient of thermal expansion, /℃3.0x 10^(-5)
Fire resistance uL94 V-0
Moisture absorption % wt gain 24 hours water immersion @25℃<0.1%
Thermal Conductivity1.2 W/m-K
Dielectric Breakdown Voltage300 volts / mil
Dielectric Constant@1MHz4.2
volume resistivity, ohm-cm @ 25℃3.0x 10^13

Package:


1kg/can

5KG A/B each.

10KG A/B each.



Comapany Profile


Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.


Ziitek Culture


Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.


China High Temperature Waterproof Dull Black Solid Thermal Epoxy Glue for Electronic Components Potting supplier

High Temperature Waterproof Dull Black Solid Thermal Epoxy Glue for Electronic Components Potting

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