High performance Heat Resistant Cooling Gel silicone Gap Filler Thermal Putty conductive for Power CPU GPU

Brand Name:Ziitek
Certification:UL
Model Number:TIF015-7 thermal Gel
Minimum Order Quantity:1000 pcs
Delivery Time:3-8 work days
Payment Terms:T/T
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Verified Supplier
Location: Dongguan Guangdong China
Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, 523460 Guangdong Province, China
Supplier`s last login times: within 2 hours
Product Details Company Profile
Product Details

High performance Heat Resistant Cooling Gel silicone Gap Filler Thermal Putty conductive for Power CPU GPU


Company Profile


Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!



TIF015-07-Specification-sheet.-pdf.pdf


TIF015-07 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and

compressibility.Due to TIF015-07 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.


TIF015-07 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility.


TIF015-07 can be applied on chip micro processor,PPGAs,MicroBGA package,BGA package,DSP chip,LED lighting and other high power electric component .


< Good thermal conductive:1.5W/mK

< Soft,very low compression
< Low thermal inpendance
< Operate automaticly


Applications


< Heat-sink & frame
< LED backlight module,LED light
< Micro heat pipe
< Vihicle enginee controler
< Telecom industey

< Semiconductor


Typical Properties of TIF015-7
Typical Uncured Material
Construction & CompositionCeramic filled silicon material*****
ColorGreenVisual
Specific Gravity2.3g/ccASTM D297
Viscosity900,000 cpsGB/T 10247
Thermal Conductivity1.5W/MkISO 22007-2
Specific Heat Capacity2.2MJ/m3KISO 22007-2
Themal diffusivity0.847mm²/sISO 22007-2
Continuous Use Temp﹣45~200℃******
Dielectric breakdown200V/milASTM D149
Flame Rating94V0E331100

Product packing details:


30cc/pc , 98cc/pc,300cc/pc, 6pcs/box
We offer the custom packaged in Syringes for automated despensing applications.

Please contact us for confirming.



Independent R&D team


Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online


FAQ


Q: Are you trading company or manufacturer ?

A: We are manufacturer in China


Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.


Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online.

China High performance Heat Resistant Cooling Gel silicone Gap Filler Thermal Putty conductive for Power CPU GPU supplier

High performance Heat Resistant Cooling Gel silicone Gap Filler Thermal Putty conductive for Power CPU GPU

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