High Thermal Conductive Carbon Fibre Based Thermal Pad For 5G Communication Equipment
Brand Name:Ziitek
Certification:RoHS
Model Number:TS-TIR700-09
Minimum Order Quantity:1000pcs
Delivery Time:3-8 work days
Payment Terms:T/T
Contact Now
Add to Cart
Verified Supplier
Location:
Dongguan Guangdong China
Address:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, 523460 Guangdong Province, China
Supplier`s last login times:
within 2 hours
Product Details
Company Profile
Product Details
High Thermal Conductive Carbon Fibre Based Thermal Pad For 5G
Communication Equipment
Company profile
Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Products introduction
TS-TIR®700-09 Series series is a high-performance carbon-based thermal pad that
combines highly thermally conductive carbon fiber with polymer
silicone materials. Utilizing advanced manufacturing processes to
precisely distribute thermal pathways, it achievese xceptional
thermal conductivity, effectively reducing interfacial thermal
resistance and enhancing heat dissipation efficiency. With its
ultra-thin, lightweight design and mechanical flexibility, it is
suitable for 5G equipment, high-performance chips, and other high
heat flux applications.
Feature
>Good thermal conductivity 9w/mK
>Ultra-low thermal resistance
>works under low pressure.
>Non-insulating material
>Non-adhesive surface
Application
>Between chips and heat dissipation modules
>5G communication equipment
>Optoelectronics industry
>wearable devices
| Typical Properties of TIR®700-09 series | ||
| Product Name | TIR®700-09 | Test Method |
| Colour | Gray | Visual |
| Construction | Carbon fiber filled silicone | ***** |
| Thickness range | 0.04"~0.20"(1.0~5.0 mm) | ASTM D374 |
| Hardness | 55±10 Shore 00 | ASTM D2240 |
| Density | 2.1 g/cm3 | ASTM D792 |
| Operation Temperature | -40℃~ 200℃ | ****** |
| Thermal impedance | 9.0W/m-K | ASTM D5470 |
| Specific heat capacity (J/g ℃) | 0.93 | ASTM E1269 @25℃ |
| Flame Rating | V-0 | UL94 |
| RoHS | Compliant | IEC62321 |
Product Specification
Standard Thickness:0.04" (1.0mm), 0.06" (1.5mm),0.08" (2.0mm),0.10"
(2.5mm),0.12" (3.0mm)
Standard Size: 1.97”x 1.97”(50.0mm x 50.0mm)
Packaging Details & Lead time
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
High Thermal Conductive Carbon Fibre Based Thermal Pad For 5G Communication Equipment
Inquiry Cart
0